Power Conversion Apparatus with Integrated Cooling Jacket and Laminated Conductor Board
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Solution Overview
Problem
Conventional power conversion apparatuses face challenges in reducing the inductance of wiring connections and managing heat generation, leading to increased size and manufacturing costs due to the need for complex cooling systems.
Innovation Solution
A power conversion apparatus with a metal casing and a cooling jacket that divides the internal space into areas to house power modules, capacitors, and control circuits, using a laminated conductor board to reduce wiring inductance and improve heat dissipation by integrating inverter circuits and capacitors within a single casing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling board is provided in each hierarchical layer to transmit heat from components to the apparatus casing, then the heat dissipation requirement is met, but the apparatus expands in height and assembling work becomes complicated
Solution Approach 1:
The patent merges the cooling board function into a single integrated structure that serves multiple hierarchical layers simultaneously. Instead of providing separate cooling boards for each layer (capacitor module layer, power module layer, inverter device layer), a unified cooling board is designed with heat transmission paths that extend through all layers, reducing the number of components and simplifying assembly while maintaining effective heat dissipation from all heat-generating components.
2Temperature
If separate cooling boards are provided for each hierarchical layer, then each component can be cooled effectively, but the dimensional size of the apparatus increases
Solution Approach 1:
The patent transitions from a vertical stacking approach with separate cooling boards for each layer to a horizontal integration approach where a single cooling board spans multiple layers. The cooling board is designed with heat transmission paths that extend horizontally across different hierarchical layers, allowing heat to be conducted laterally to cooling regions rather than requiring additional vertical space for separate cooling structures.
3Device complexity
If conventional wiring connections are used between capacitor module and power modules, then the apparatus structure is simple, but the inductance of wiring is high
Solution Approach 1:
The patent introduces a DC side conductor board as an intermediary component that provides optimized electrical connections between the capacitor module and power modules. This conductor board is specifically designed with low-inductance wiring paths and direct connection points, serving as a dedicated mediator for high-current DC connections while maintaining overall structural simplicity. The conductor board acts as an intermediate layer that reduces wiring inductance without requiring complex reconfiguration of the entire apparatus.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces wiring inductance, minimizes heat generation, and enhances cooling efficiency, resulting in a more compact and cost-effective power conversion apparatus.
Implementation Method 1
a cooling jacket having a cooling water path and being provided at the inner periphery of the side wall to form a first area between the lower cover and itself
Data Source
AI summary
The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.