Power Conversion Device Compact Cooling via Interconnected Cases
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Solution Overview
Problem
Existing power conversion devices for vehicles face challenges in reducing size while maintaining high cooling performance due to the need for extensive heat dissipation structures and space requirements for semiconductor modules.
Innovation Solution
The design incorporates multiple power semiconductor modules with interconnected cases and flange portions to create flow path spaces for coolant flow, reducing the overall size and enhancing cooling efficiency by optimizing the flow path area and eliminating unnecessary sealing structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water path walls are provided adjacent to heat dissipation portions to narrow water path sectional area, then cooling performance is improved, but device size increases due to additional space requirements
Solution Approach 1:
The patent merges the water path wall structure with the semiconductor module housing structure. The housing case serves dual functions: enclosing the semiconductor device and forming the water path wall adjacent to the heat dissipation portion. This integration eliminates the need for separate water path walls and reduces the space required for cooling structures, thereby improving cooling performance without increasing device size.
2Reliability
If spaces are provided between water path walls and heat dissipation portions to prevent interference, then manufacturing reliability is improved, but device size increases
Solution Approach 1:
The housing case is designed to integrally form both the enclosure and the water path wall structure. The water path wall is formed as part of the housing case itself, positioned adjacent to the heat dissipation portion of the semiconductor device. This integrated design eliminates interference issues between separate components while maintaining manufacturing reliability and reducing the space required for cooling structures.
3Ease of manufacture
If flange portions and connection spaces are provided for mounting semiconductor modules, then ease of assembly is improved, but device size increases
Solution Approach 1:
The housing case integrates mounting structures and connection interfaces directly into its body. The case includes integrated features for mounting semiconductor modules, eliminating the need for separate flange portions and connection spaces. This integration maintains ease of assembly while significantly reducing the overall device size by eliminating unnecessary structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact power conversion device with improved cooling performance, reducing the device's size and enhancing thermal management without compromising insulation reliability.
Implementation Method 1
heat generated from the power semiconductor device by on-off operation
Implementation Method 2
allowing a coolant to flow between the second case and the first case
Data Source
AI summary
Size reduction of a power conversion device is intended. A power conversion device according to the present invention includes: a first power semiconductor module; a second semiconductor module; and a fixing member which fixes the first power semiconductor module, wherein the first power semiconductor module has a first power semiconductor device, a first case which houses the first power semiconductor device, and a first flange portion connected to the case, the second power semiconductor module has a second power semiconductor device, and a second case which houses the second power semiconductor device, the second case is connected to the first flange portion so as to provide a first flow path space for allowing a coolant to flow between the second case and the first case, and the first flange portion is fixed to the fixing member while supporting the first case and the second power semiconductor module.