Power Conversion Device Cooling Layout
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Solution Overview
Problem
Existing power conversion devices face challenges in efficiently cooling capacitors and current sensors due to their placement adjacent to semiconductor modules, leading to increased heat generation and device length, which hinders miniaturization and efficiency.
Innovation Solution
The power conversion device reconfigures the layout by positioning the capacitor on one side and the current sensor on the orthogonal side of the layered body, allowing them to be cooled by the cooling pipes and reducing the length of bus bars, thereby minimizing heat generation and device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the capacitor and current sensor are positioned adjacent to the layered body in the protruding direction of power terminals, then the device structure is simplified, but the cooling efficiency decreases and the device length increases
Solution Approach 1:
The patent repositions the capacitor and current sensor from the protruding direction (Z-axis) to the lateral direction (X-axis or Y-axis) of the layered body. This dimensional change allows these components to be cooled by cooling pipes located on the sides of the layered body, improving cooling efficiency while reducing the protruding length of the device.
2Device complexity
If the capacitor and current sensor are positioned adjacent to the layered body in the protruding direction of power terminals, then the device structure is simplified, but the device length increases
Solution Approach 1:
The patent repositions the capacitor and current sensor from the protruding direction (Z-axis) to the lateral direction (X-axis or Y-axis) of the layered body. This dimensional change allows these components to be cooled by cooling pipes located on the sides of the layered body, improving cooling efficiency while reducing the protruding length of the device.
3Temperature
If the capacitor is cooled by positioning it close to the layered body, then cooling efficiency improves, but the bus bar length increases and heat generation increases
Solution Approach 1:
The patent repositions the capacitor and current sensor from the protruding direction (Z-axis) to the lateral direction (X-axis or Y-axis) of the layered body. This dimensional change allows these components to be cooled by cooling pipes located on the sides of the layered body, improving cooling efficiency while reducing the protruding length of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency for capacitors and current sensors, reduces heat-related temperature increases, and miniaturizes the device by optimizing the placement of components relative to the cooling system.
Implementation Method 1
cooling pipes cooling the semiconductor modules
Implementation Method 2
cooling pipes cooling the semiconductor modules
Implementation Method 3
a capacitor smoothing a DC voltage applied to each of the semiconductor modules
Data Source
AI summary
In a power conversion device, each of semiconductor modules of a layered body includes a body portion incorporating a plurality of switching elements and a plurality of power terminals protruding therefrom. The semiconductor modules include upper-arm switching elements and lower-arm switching element that are alternately layered in a layering direction of the layered body. A capacitor is disposed on one side of the layered body and a current sensor is disposed on an opposite side of the layered body, in an orthogonal direction orthogonal to both a protruding direction of the power terminals and the layering direction. Each of the semiconductor modules includes, as the power terminals, two collector terminals connected to a collector electrode of the switching element and one emitter terminal connected to an emitter electrode of the switching element, and the emitter terminal is disposed between the two collector terminals in the orthogonal direction.