Power Conversion Device Heat Dissipation Layout
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Solution Overview
Problem
Power conversion devices in electric vehicles face challenges in downsizing and cost reduction due to complex heat dissipation structures and increased thermal resistance, which complicates the layout and productivity of these devices.
Innovation Solution
A power conversion device with a housing having a flat cooling surface and separate mounting surfaces for high- and low-heat generation components, allowing for efficient heat dissipation and simplified structure, enabling size reduction and cost optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If recesses are formed on the metal case to match the shapes and heights of electric components, then heat dissipation efficiency is improved, but the shape of the metal case becomes complicated and thermal resistance in the surface direction increases
Solution Approach 1:
The patent applies local quality by creating a recess only in the specific area where the high-heat-generation electric component is mounted, while keeping other areas of the metal case flat. This localized approach allows efficient heat dissipation for the high-heat component without complicating the overall case structure, thereby resolving the contradiction between heat dissipation efficiency and structural simplicity.
2Temperature
If multiple recesses with different shapes are formed for different electric components, then heat dissipation is improved, but productivity deteriorates and cost increases
Solution Approach 1:
The patent creates a single recess only in the area corresponding to the high-heat-generation component, rather than forming multiple recesses for different components. This localized modification simplifies the manufacturing process, maintains high productivity, and reduces costs while still achieving effective heat dissipation for the components that need it most.
3Temperature
If a large recess is formed to accommodate components with small height, then heat dissipation is improved, but the heights of surrounding components are restricted and layout flexibility is reduced
Solution Approach 1:
The patent forms a recess only in the specific area where the high-heat-generation component is located, rather than creating a large recess that would restrict surrounding components. This localized approach maintains heat dissipation efficiency for the target component while preserving layout flexibility and allowing components of various heights to be positioned freely in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures effective heat dissipation for high-heat generation components while simplifying the device structure, facilitating downsizing and reducing costs by improving productivity.
Implementation Method 1
heat of the electric component is directly transferred to the metal case and the metal case functions as a heat dissipation surface, whereby heat of the heat generating component can be efficiently dissipated to the metal case and the heat generating component can be cooled
Data Source
AI summary
The power conversion device includes: a housing; an electric wiring board stored in the housing; a first heat generating component provided on the one surface of the electric wiring board; a second heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is equal to or smaller than a protruding height of the first heat generating component, the second heat generating component being provided on the one surface of the electric wiring board; and a third heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is greater than the protruding height of the first heat generating component, the third heat generating component being provided on another surface of the electric wiring board.