Electric Power Conversion Device Height Reduction Layout

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Solution Overview

Problem

Existing electric power conversion devices for vehicles face challenges in reducing height while maintaining high performance, as previous configurations have not adequately addressed the need for compactness without compromising functionality.

Innovation Solution

The electric power conversion device is designed with a first, second, and third power semiconductor module arranged in a specific orthogonal configuration, where the third module and AC circuit body are disposed in a parallel direction to the first and second modules, respectively, allowing for reduced height and improved cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If three power semiconductor modules are arranged in a line, then height reduction is achieved, but device complexity increases and performance may be compromised

Engineering Contradiction:
Improveheight of electric power conversion deviceVSAvoidarrangement complexity of power semiconductor modules
Core Design Contradiction:
Length of stationary objectVSDevice complexity

Solution Approach 1:

The patent transitions from a one-dimensional linear arrangement to a two-dimensional planar arrangement. The first and second power semiconductor modules are arranged side-by-side in a first column, while the third module is positioned in a second column parallel to the first column, creating a distributed two-dimensional layout that reduces height while maintaining functional performance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the power semiconductor modules into separate functional groups arranged in parallel columns. The first and second modules handle specific phases while the third module handles another phase, with each module independently positioned to optimize spatial distribution and reduce overall device height

Inventive Principle:
Principle #1Segmentation

2Length of stationary object

If power semiconductor modules are arranged to reduce height, then compactness is improved, but cooling efficiency deteriorates

Engineering Contradiction:
Improveheight of electric power conversion deviceVSAvoidcooling efficiency of power semiconductor modules
Core Design Contradiction:
Length of stationary objectVSTemperature

Solution Approach 1:

By arranging modules in a two-dimensional planar configuration rather than stacking them vertically, the patent increases the surface area available for heat dissipation while maintaining reduced height. The parallel column arrangement allows cooling surfaces to be distributed across a larger horizontal footprint

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent positions the third power semiconductor module in a separate parallel column with optimized spacing from the first and second modules. This local spatial arrangement ensures adequate cooling airflow and heat dissipation pathways for each module while maintaining overall compactness

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10177675B2Electric power conversion device
Publication Date: 2019.01.08 ASTEMO LTD
  • US10177675B2 patent drawing
  • US10177675B2 patent drawing
  • US10177675B2 patent drawing

AI summary

An object of the present invention is to achieve reduction in height of an electric power conversion device while maintaining high performance of the electric power conversion device. An electric power conversion device according to the present invention includes: a first power semiconductor module, a second power semiconductor module, a third power semiconductor module, and an AC circuit body that transmits and detects U-phase, V-phase, and W-phase AC currents, and when a direction along an arrangement direction of the first power semiconductor module and the second power semiconductor module is defined as a first column, the third power semiconductor module and the AC circuit body are disposed along a second column being in a direction parallel to the first column, and the AC circuit body is disposed in a space that is in a direction orthogonal to the first column and faces the second power semiconductor module, and is in a direction parallel to the second column and faces the third power semiconductor module.