Electric Power Conversion Device Height Reduction Layout
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Solution Overview
Problem
Existing electric power conversion devices for vehicles face challenges in reducing height while maintaining high performance, as previous configurations have not adequately addressed the need for compactness without compromising functionality.
Innovation Solution
The electric power conversion device is designed with a first, second, and third power semiconductor module arranged in a specific orthogonal configuration, where the third module and AC circuit body are disposed in a parallel direction to the first and second modules, respectively, allowing for reduced height and improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If three power semiconductor modules are arranged in a line, then height reduction is achieved, but device complexity increases and performance may be compromised
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement to a two-dimensional planar arrangement. The first and second power semiconductor modules are arranged side-by-side in a first column, while the third module is positioned in a second column parallel to the first column, creating a distributed two-dimensional layout that reduces height while maintaining functional performance
Solution Approach 2:
The patent divides the power semiconductor modules into separate functional groups arranged in parallel columns. The first and second modules handle specific phases while the third module handles another phase, with each module independently positioned to optimize spatial distribution and reduce overall device height
2Length of stationary object
If power semiconductor modules are arranged to reduce height, then compactness is improved, but cooling efficiency deteriorates
Solution Approach 1:
By arranging modules in a two-dimensional planar configuration rather than stacking them vertically, the patent increases the surface area available for heat dissipation while maintaining reduced height. The parallel column arrangement allows cooling surfaces to be distributed across a larger horizontal footprint
Solution Approach 2:
The patent positions the third power semiconductor module in a separate parallel column with optimized spacing from the first and second modules. This local spatial arrangement ensures adequate cooling airflow and heat dissipation pathways for each module while maintaining overall compactness
Data Source
AI summary
An object of the present invention is to achieve reduction in height of an electric power conversion device while maintaining high performance of the electric power conversion device. An electric power conversion device according to the present invention includes: a first power semiconductor module, a second power semiconductor module, a third power semiconductor module, and an AC circuit body that transmits and detects U-phase, V-phase, and W-phase AC currents, and when a direction along an arrangement direction of the first power semiconductor module and the second power semiconductor module is defined as a first column, the third power semiconductor module and the AC circuit body are disposed along a second column being in a direction parallel to the first column, and the AC circuit body is disposed in a space that is in a direction orthogonal to the first column and faces the second power semiconductor module, and is in a direction parallel to the second column and faces the third power semiconductor module.


