Power Conversion Device Discharge Resistance Substrate Thermal Management
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Solution Overview
Problem
Existing power conversion devices face challenges in reducing the overall size while maintaining component longevity due to thermal energy generated by discharge resistances, leading to potential deterioration of capacitor elements.
Innovation Solution
A power conversion device design featuring a discharge resistance substrate arranged between the capacitor module and the control circuit substrate, perpendicular to the control circuit substrate, effectively separates discharge resistances from capacitor elements, enhancing thermal energy dissipation and reducing temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the discharge resistance is arranged close to the capacitor module to reduce device size, then the overall size is reduced, but the thermal energy from the discharge resistance causes deterioration of the capacitor elements
Solution Approach 1:
The discharge resistance substrate is arranged perpendicular to the control circuit substrate, extending in the vertical direction between the capacitor module and control circuit substrate. This three-dimensional arrangement allows the discharge resistance to be positioned close to the capacitor module for compactness while maintaining thermal separation through vertical spacing, resolving the contradiction between device size reduction and capacitor element protection from thermal damage.
2Temperature
If the discharge resistance substrate is separated from the capacitor module and control circuit substrate, then thermal energy dissipation is improved, but the device complexity increases
Solution Approach 1:
The discharge resistance substrate is integrated with the capacitor module assembly, forming a unified structure where the discharge resistance substrate is positioned between the capacitor module and control circuit substrate. This merging approach allows thermal separation without requiring entirely separate mounting structures, thus improving heat dissipation while minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses capacitor element deterioration, achieves a compact size, and extends the device's lifetime by efficiently managing thermal energy and improving cooling efficiency.
Implementation Method 1
effectively separates discharge resistances from capacitor elements, enhancing thermal energy dissipation and reducing temperature rise
Data Source
AI summary
A power conversion device has semiconductor modules, a cooling unit, a capacitor module, a discharge resistance substrate, a control circuit substrate and a casing. The semiconductor modules from a power conversion circuit. The capacitor module is electrically connected to the semiconductor module. The discharge resistance is arranged on the discharge resistance substrate, and electrically discharges the capacitor module. The control circuit substrate controls operation of the semiconductor modules. The casing accommodates the semiconductor module, the cooling unit, the capacitor module, the discharge resistance substrate and the control circuit substrate. The discharge resistance substrate is arranged between an outer wall surface of the capacitor module and the control circuit substrate and arranged in a direction perpendicular to the control circuit substrate so that the discharge resistance substrate is separated in position from the outer wall surface of the capacitor module and the control circuit substrate.