Power Conversion Apparatus Compact Driver Circuit Board Design

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Solution Overview

Problem

The existing power conversion apparatuses for hybrid electric vehicles and electric vehicles face challenges in reducing size and improving reliability, particularly in high output torque conditions and limited engine room space.

Innovation Solution

The power conversion apparatus incorporates a power semiconductor module, a driver circuit board with a transformer for voltage transformation, and through holes for simplified wiring, allowing for compact integration and enhanced reliability by minimizing the weak current system's vulnerability to AC-side relay conductor voltage changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the wiring distance of the driver circuit board is reduced to minimize space, then the size of the power conversion apparatus is reduced, but the reliability may be compromised due to increased electrical interference and heat accumulation

Engineering Contradiction:
Improvesize of power conversion apparatusVSAvoidreliability of power conversion apparatus
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The driver circuit board is divided into distinct functional regions: a high-voltage region for power conversion circuits and a low-voltage region for control circuits. This segmentation isolates the sensitive control circuits from the high-voltage power conversion circuits, reducing electrical interference while maintaining compact dimensions. The physical separation of voltage zones allows reliable operation in a reduced overall apparatus size.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A shield structure is introduced as an intermediary element between the high-voltage and low-voltage regions on the driver circuit board. This shield acts as a barrier that blocks electromagnetic interference from the power conversion circuits from affecting the control circuits, enabling closer wiring distances without compromising reliability. The shield mediates the interaction between conflicting voltage zones.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the power conversion apparatus is made more compact for vehicle mounting, then the mountability is improved, but the heat dissipation capability may be reduced

Engineering Contradiction:
Improvesize of power conversion apparatusVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The driver circuit board incorporates region-specific thermal management designs: high-heat generation areas (power conversion circuits) are provided with enhanced cooling structures such as heat sinks or thermal vias, while low-heat areas (control circuits) use standard thermal pathways. This localized thermal management allows effective heat dissipation within a compact overall apparatus size, improving both mountability and thermal performance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the size of the power conversion apparatus while improving its reliability by simplifying circuit wiring and protecting the weak current system from voltage fluctuations, thus enhancing its performance in high output torque conditions.

Implementation Method 1

The driver circuit board includes a transformer for transforming voltage from low to high and supplying the transformed voltage to the driver circuit

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS10291148B2Power conversion apparatus
Publication Date: 2019.05.14 ASTEMO LTD
  • US10291148B2 patent drawing
  • US10291148B2 patent drawing
  • US10291148B2 patent drawing

AI summary

An object of the present invention is to reduce the size of a power conversion apparatus and to improve the reliability. The power conversion apparatus includes a power semiconductor module, a driver circuit board mounted with a driver circuit, an AC-side relay conductor for transferring the alternating current, and an AC connector. The power semiconductor module includes an AC-side terminal connected to the AC-side relay conductor, and a control-side terminal connected to the driver circuit board. The AC connector is provided on the opposite side of the power semiconductor module through the driver circuit board. The driver circuit board includes a transformer for transforming voltage from low to high and supplying the transformed voltage to the driver circuit, and a line for connecting the transformer and the driver circuit. Further, the driver circuit board forms a through hold provided on the side opposite to the transformer with the driver circuit interposed therebetween. The AC-side relay conductor is connected to the AC-side connector, through the through hole.