Power Conversion Device Flame Barrier Case Design
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Solution Overview
Problem
Conventional power semiconductor modules are prone to secondary fires due to air ingress through empty openings, leading to flame propagation and potential ignition when the semiconductor breaks, causing abnormal heat generation.
Innovation Solution
The power conversion device incorporates a case with projections on its openings to reduce clearance and prevent flame ejection, and optionally uses insulating resin coating to seal openings, thereby preventing air ingress and flame propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple openings are provided in the power semiconductor module for manufacturing flexibility, then the degree of freedom in manufacturing is improved, but air can easily enter through these openings causing fire hazards
Solution Approach 1:
The patent applies preliminary anti-action by providing a case that covers and seals the openings in the power semiconductor module before the module is installed or used. This preventive measure blocks air from entering through the openings, thereby preventing fire hazards while maintaining the manufacturing flexibility benefits of having multiple openings. The case is designed to cover all openings including those for lead frames and empty openings, creating a fire-resistant barrier.
2Ease of manufacture
If the module structure is simplified for cost reduction, then manufacturing cost is improved, but fire safety may be compromised due to easier air ingress
Solution Approach 1:
The patent merges the protective function with the existing module structure by integrating a case that covers the power semiconductor module. This case serves multiple functions: it protects the module from fire hazards by sealing openings, provides structural support, and can be manufactured as a single integrated component. By combining protection and structure into one element, the solution adds minimal cost while significantly improving fire safety.
3Ease of operation
If openings are left open for lead frame access, then ease of assembly is improved, but flame can easily blow out and cause secondary fire spread
Solution Approach 1:
The patent applies local quality by providing a case that selectively covers specific openings in the power semiconductor module while allowing access to necessary connection points. The case is designed with localized openings or access points that maintain assembly ease for lead frame connections, while other areas are sealed to prevent flame propagation. This localized approach ensures that assembly operations remain simple while fire safety is improved in critical areas.
Data Source
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AI summary
The invention addresses the problem that when a semiconductor module is broken, a flame caused by an abnormal heat generation occurring inside is blown out from, for example, an opening and fire spreads to other components inside a power conversion device, thereby possibly causing a secondary fire spread in the power conversion device. A power conversion device comprises: a power semiconductor; cooling fins for cooling the power semiconductor; a first case disposed between the power semiconductor and the cooling fins and equipped with an opening matching the shape of the power semiconductor; and a second case for covering a lead terminal opening provided on the power semiconductor.