Power Conversion Heat Dissipation Module Design

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Solution Overview

Problem

Current power conversion apparatuses for electric vehicles have low power density and inefficient heat dissipation, resulting in a large overall volume and reduced performance.

Innovation Solution

The power conversion apparatus optimizes component layout, using a thermal conductive insulating heat-dissipation module to adhere power devices to a heat-dissipation wall and coolant runner, reducing interface thermal resistance and simplifying assembly, while accommodating components in grooves for enhanced heat dissipation and reduced volume.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat dissipation design is used in power conversion apparatus, then heat dissipation function is provided, but the overall volume is large and power density is low

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidoverall volume
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The patent combines the heat dissipation function with the housing structure by integrating coolant runners directly into the housing body. The housing serves dual purposes: structural enclosure and active heat dissipation through embedded coolant channels that contact the power conversion module housing, eliminating the need for separate heat dissipation components and reducing overall volume.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing is designed with multi-functionality, serving both as the structural enclosure and as the heat dissipation system. The coolant runners embedded in the housing allow the same component (housing) to perform both mechanical support and thermal management functions, thereby reducing the number of separate components and improving power density.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If conventional component layout is used, then assembly is provided, but assembly structure is complex and reliability is reduced

Engineering Contradiction:
Improveassembly structureVSAvoidassembly reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent segments the assembly into modular units: the power conversion module as a complete sub-assembly, the housing with integrated coolant runners, and the control module. This segmentation allows each module to be manufactured and tested independently, then assembled together, simplifying the overall assembly process while improving reliability through modular design that isolates potential failure points.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat-dissipation capability, reduces the overall volume, and increases power density, making the power conversion apparatus more reliable and cost-effective.

Implementation Method 1

The thermal conductive insulating sheet is adhered to the corresponding heat-dissipation wall... the power device is thermally coupled to the heat-dissipation wall and the coolant runner via the thermal conductive insulating sheet

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat-dissipation wall and the accommodating groove of the housing all being thermally coupled to the coolant runner of the housing

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10660243B2Power conversion apparatus including a heat-dissipation module
Publication Date: 2020.05.19 DELTA ELECTRONICS (SHANGHAI) CO LTD
  • US10660243B2 patent drawing
  • US10660243B2 patent drawing
  • US10660243B2 patent drawing

AI summary

A power conversion apparatus is provided, which comprises a housing, a mother board, a first electromagnetic filtering board, a second electromagnetic filtering board, a signal board, a capacitor board, and a heat-dissipation module. The housing includes a heat-dissipation wall and a coolant runner. The mother board is disposed upon the housing and comprises a first surface facing the housing and a power device. The heat-dissipation module includes an thermal conductive insulating sheet adhered to the heat-dissipation wall and an elastic clamp. When the mother board approaches the housing to clamp the power device in the accommodating space between the elastic clamp and the thermal conductive insulating sheet, the power device is pressed against by the elastic clamp and thus adhered to the thermal conductive insulating sheet, so that the power device is thermally coupled to the heat-dissipation wall and the coolant runner via the thermal conductive insulating sheet.