Power Conversion Device Cooling Passage Segmentation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing power conversion devices face challenges in dissipating heat from the interior of the frame body to the exterior when the ambient temperature is higher than the internal temperature, leading to temperature rise issues within the frame body.

Innovation Solution

A power conversion device with a heat dissipating structure that includes a power conversion circuit unit mounted on a heatsink with a first passage for a cooling medium, and a frame body with a second passage that connects to the heatsink, forming a cooling passage to simultaneously cool the frame body and the heatsink, thereby restricting temperature rise within the frame body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an air-cooled heat dissipating structure is provided in the frame body to dissipate heat to the exterior, then heat dissipation is improved under normal conditions, but when ambient temperature is higher than frame body interior temperature, heat cannot be dissipated from interior to exterior

Engineering Contradiction:
Improveframe body interior temperatureVSAvoidheat dissipation capability under different ambient conditions
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The cooling system is segmented into two independent passages: a first passage in the heatsink for direct cooling of the semiconductor element, and a second passage in the frame body for cooling the frame interior. This segmentation allows each passage to be optimized for its specific function and enables independent operation, so the frame body can be cooled even when ambient temperature is higher than the frame interior temperature.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cooling medium circulation system serves multiple functions: it cools the semiconductor switching element through the heatsink, cools the frame body interior through the second passage, and can operate effectively regardless of ambient temperature conditions. The system is designed to maintain cooling capability across different thermal environments by providing dedicated cooling paths.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for effective cooling of the frame body and the heatsink, maintaining a stable operating state even in high ambient temperatures by circulating a cooling medium through both the heatsink and the frame body, thus regulating the internal temperature of the device.

Implementation Method 1

a first passage through which a cooling medium is caused to pass... a second passage through which a cooling medium is caused to pass... configuring a cooling passage

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10440864B2Power conversion device
Publication Date: 2019.10.08 MITSUBISHI ELECTRIC MOBILITY CORP
  • US10440864B2 patent drawing
  • US10440864B2 patent drawing
  • US10440864B2 patent drawing

AI summary

A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.