Power Conversion Device Thermal Management via Potting Resin and Heatsink

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Power conversion devices in electric and hybrid vehicles face challenges in heat dissipation and vibration resistance due to thermal expansion of potting resin, leading to decreased inductance values and potential damage.

Innovation Solution

A power conversion device design that includes an electromagnetic induction instrument with an upper and lower core electromagnetically coupled across a coil body, a frame body, and a potting resin member, where the space between the frame body and the instrument is filled, and a fixing member covers the upper core to secure it to the frame body, enhancing heat dissipation and vibration resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the drive frequency is increased to reduce the size of the electromagnetic induction instrument, then the inductance value can be reduced and the device size decreases, but heat loss due to core material increases markedly and core temperature rises

Engineering Contradiction:
Improvedevice sizeVSAvoidheat loss
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent changes the physical state and parameters of the potting resin by selecting materials with specific thermal conductivity values (0.3 W/mK or higher) and controlling filling heights at different stages (first filling height below upper core, second filling height submerging heatsink), thereby optimizing heat dissipation while maintaining electrical insulation and mechanical protection properties

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a heatsink as an intermediary thermal management component between the upper core and the potting resin. The heatsink conducts heat from the core to the resin more efficiently, acting as a thermal mediator that enables effective heat dissipation without requiring complete submersion of the core in resin

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the core sectional area is reduced to decrease device size, then the inductance value can be reduced, but core thermal resistance increases and heat dissipation becomes difficult

Engineering Contradiction:
Improvecore sizeVSAvoidcore temperature
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent transitions from relying solely on horizontal heat dissipation through the core width to utilizing vertical heat dissipation through the potting resin medium. By filling the space above and around the core with thermally conductive resin, the heat dissipation path extends into the vertical dimension, compensating for the reduced core sectional area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The potting resin serves as a thermal intermediary that bridges the core and the external environment. The resin fills the gap between the core and housing, providing a continuous thermal conduction path that enables heat to escape from the reduced-size core effectively

Inventive Principle:
Principle #24Intermediary (Mediator)

3Loss of energy

If potting resin is used to fill the space for heat dissipation, then heat dissipation efficiency increases, but thermal expansion of the resin causes core separation at the abutment interface and inductance value decreases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidinductance value stability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent applies preliminary mechanical fastening actions using fastening members (screws, clips, or adhesives) to secure the upper core to the housing before the potting resin cures. This preliminary action pre-establishes the correct positional relationship and prevents thermal expansion forces from causing core separation later during operation

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent designs the fastening structure to accommodate and cushion the thermal expansion of the potting resin. The fastening members are configured to maintain clamping force on the core while allowing for resin expansion, thereby cushioning against the harmful effects of thermal expansion that would otherwise cause core separation

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

4Loss of energy

If the filling height of potting resin is increased to improve heat dissipation, then more heat can be dissipated, but the device weight and cost increase

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice weight
Core Design Contradiction:
Loss of energyVSWeight of stationary object

Solution Approach 1:

The patent applies different filling heights in different local regions: the first filling height is set below the upper core to provide basic insulation and positioning, while the second filling height submerges only the heatsink to provide enhanced heat dissipation where needed. This localized quality approach optimizes heat dissipation without unnecessarily increasing weight throughout the entire device

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses partial action by filling the resin only to the extent necessary for heat dissipation (submerging the heatsink) rather than completely filling the housing. This partial filling provides sufficient thermal management while avoiding the excessive weight and cost that would result from complete filling

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design stabilizes the power conversion device by preventing inductance value decreases, ensures high vibration resistance, and achieves a smaller, lighter, and cost-effective device with improved heat dissipation.

Implementation Method 1

heat lost from the transformer and the inductor element is efficiently caused to dissipate into a cooler by a gap between the transformer and inductor element and the housing space in the case being filled with a resin having heat dissipating properties

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an electromagnetic induction instrument is mounted as a passive component that carries out a voltage step-up operation or step-down operation

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 3

the cores are separated at a core abutment interface portion due to thermal expansion of the potting resin accompanying a rise in temperature when driving the power conversion device

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11165342B2Power conversion device
Publication Date: 2021.11.02 MITSUBISHI ELECTRIC CORP
  • US11165342B2 patent drawing
  • US11165342B2 patent drawing
  • US11165342B2 patent drawing

AI summary

A power conversion device such that heat dissipation of an electromagnetic induction instrument can be increased, and inductance value durability and vibration resistance of the electromagnetic induction instrument is high, is provided. Also, a power conversion device reduced in size and weight is provided. A power conversion device includes an electromagnetic induction instrument wherein an upper core and a lower core having magnetism are electromagnetically coupled across a coil body, a frame body on which the electromagnetic induction instrument is mounted, a potting resin member with which a space between the frame body and the electromagnetic induction instrument is filled, and a fixing member, disposed above the electromagnetic induction instrument so as to cover the upper core, of which an end portion is attached to the frame body, wherein the electromagnetic induction instrument is fixed to the frame body by the fixing member.