Power Conversion Device Thermal Management via Potting Resin and Heatsink
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power conversion devices in electric and hybrid vehicles face challenges in heat dissipation and vibration resistance due to thermal expansion of potting resin, leading to decreased inductance values and potential damage.
Innovation Solution
A power conversion device design that includes an electromagnetic induction instrument with an upper and lower core electromagnetically coupled across a coil body, a frame body, and a potting resin member, where the space between the frame body and the instrument is filled, and a fixing member covers the upper core to secure it to the frame body, enhancing heat dissipation and vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the drive frequency is increased to reduce the size of the electromagnetic induction instrument, then the inductance value can be reduced and the device size decreases, but heat loss due to core material increases markedly and core temperature rises
Solution Approach 1:
The patent changes the physical state and parameters of the potting resin by selecting materials with specific thermal conductivity values (0.3 W/mK or higher) and controlling filling heights at different stages (first filling height below upper core, second filling height submerging heatsink), thereby optimizing heat dissipation while maintaining electrical insulation and mechanical protection properties
Solution Approach 2:
The patent introduces a heatsink as an intermediary thermal management component between the upper core and the potting resin. The heatsink conducts heat from the core to the resin more efficiently, acting as a thermal mediator that enables effective heat dissipation without requiring complete submersion of the core in resin
2Volume of moving object
If the core sectional area is reduced to decrease device size, then the inductance value can be reduced, but core thermal resistance increases and heat dissipation becomes difficult
Solution Approach 1:
The patent transitions from relying solely on horizontal heat dissipation through the core width to utilizing vertical heat dissipation through the potting resin medium. By filling the space above and around the core with thermally conductive resin, the heat dissipation path extends into the vertical dimension, compensating for the reduced core sectional area
Solution Approach 2:
The potting resin serves as a thermal intermediary that bridges the core and the external environment. The resin fills the gap between the core and housing, providing a continuous thermal conduction path that enables heat to escape from the reduced-size core effectively
3Loss of energy
If potting resin is used to fill the space for heat dissipation, then heat dissipation efficiency increases, but thermal expansion of the resin causes core separation at the abutment interface and inductance value decreases
Solution Approach 1:
The patent applies preliminary mechanical fastening actions using fastening members (screws, clips, or adhesives) to secure the upper core to the housing before the potting resin cures. This preliminary action pre-establishes the correct positional relationship and prevents thermal expansion forces from causing core separation later during operation
Solution Approach 2:
The patent designs the fastening structure to accommodate and cushion the thermal expansion of the potting resin. The fastening members are configured to maintain clamping force on the core while allowing for resin expansion, thereby cushioning against the harmful effects of thermal expansion that would otherwise cause core separation
4Loss of energy
If the filling height of potting resin is increased to improve heat dissipation, then more heat can be dissipated, but the device weight and cost increase
Solution Approach 1:
The patent applies different filling heights in different local regions: the first filling height is set below the upper core to provide basic insulation and positioning, while the second filling height submerges only the heatsink to provide enhanced heat dissipation where needed. This localized quality approach optimizes heat dissipation without unnecessarily increasing weight throughout the entire device
Solution Approach 2:
The patent uses partial action by filling the resin only to the extent necessary for heat dissipation (submerging the heatsink) rather than completely filling the housing. This partial filling provides sufficient thermal management while avoiding the excessive weight and cost that would result from complete filling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes the power conversion device by preventing inductance value decreases, ensures high vibration resistance, and achieves a smaller, lighter, and cost-effective device with improved heat dissipation.
Implementation Method 1
heat lost from the transformer and the inductor element is efficiently caused to dissipate into a cooler by a gap between the transformer and inductor element and the housing space in the case being filled with a resin having heat dissipating properties
Implementation Method 2
an electromagnetic induction instrument is mounted as a passive component that carries out a voltage step-up operation or step-down operation
Implementation Method 3
the cores are separated at a core abutment interface portion due to thermal expansion of the potting resin accompanying a rise in temperature when driving the power conversion device
Data Source
AI summary
A power conversion device such that heat dissipation of an electromagnetic induction instrument can be increased, and inductance value durability and vibration resistance of the electromagnetic induction instrument is high, is provided. Also, a power conversion device reduced in size and weight is provided. A power conversion device includes an electromagnetic induction instrument wherein an upper core and a lower core having magnetism are electromagnetically coupled across a coil body, a frame body on which the electromagnetic induction instrument is mounted, a potting resin member with which a space between the frame body and the electromagnetic induction instrument is filled, and a fixing member, disposed above the electromagnetic induction instrument so as to cover the upper core, of which an end portion is attached to the frame body, wherein the electromagnetic induction instrument is fixed to the frame body by the fixing member.


