Power Conversion Device Insulating Extended Portion Design

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Solution Overview

Problem

In power conversion devices, reducing the size while maintaining insulating properties is challenging due to the high voltage applied to input/output terminals and the proximity of these terminals to the metallic member, which increases the risk of short circuits.

Innovation Solution

A power conversion device design that includes a semiconductor module with an input/output terminal, a connecting member with an insulating resin portion, and a metallic member with an opening for the terminal, featuring extended insulating portions between the terminal and the metallic member to secure insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of the power conversion device is reduced and the space between the edge of the opening of the metallic member and the input/output terminal is made small, then the device size is reduced, but it is difficult to secure insulating properties and there is a possibility of short circuit

Engineering Contradiction:
Improvedevice sizeVSAvoidinsulating properties
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces a resin portion as an intermediary insulating material between the metallic member and the input/output terminal. This resin portion fills the space between these components, providing electrical insulation while allowing the terminal to protrude through the opening in the metallic member. The intermediary resin material resolves the contradiction by enabling close spacing without compromising insulating properties.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite material construction where the connecting member integrates both metallic portions (for structural support and heat dissipation) and resin portions (for electrical insulation). This composite approach allows the device to achieve compact dimensions while maintaining adequate insulation between high-voltage terminals and the metallic housing, thus resolving the size-insulation contradiction.

Inventive Principle:
Principle #40Composite materials

2Strength

If the power semiconductor module is clamped by a module pressing member and a heat sink, then the module is securely held, but large rigidity is required making it difficult to achieve reduction in size

Engineering Contradiction:
Improveclamping strengthVSAvoiddevice size
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The patent merges the module pressing member and heat sink into a single integrated component. This unified structure combines the clamping function (holding the power semiconductor module securely) with the heat dissipation function (cooling the module), eliminating the need for separate components and thereby reducing overall device size while maintaining adequate clamping strength.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated pressing member-heat sink structure performs multiple functions simultaneously: it provides mechanical support and clamping force to hold the power semiconductor module, conducts heat away from the module for thermal management, and serves as part of the structural housing. This multi-functionality reduces the number of components needed, enabling size reduction while maintaining clamping strength.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively prevents short circuits by maintaining insulating properties even at high voltages and allows for reduced device size through enhanced thermal coupling and cooling efficiency.

Implementation Method 1

The connecting member has an insulating extended portion extending in a space between the terminal and the opening of the metallic member

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a metallic member having an opening through which the terminal protrudes and supporting the semiconductor module

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10506744B2Power conversion device
Publication Date: 2019.12.10 ASTEMO LTD
  • US10506744B2 patent drawing
  • US10506744B2 patent drawing
  • US10506744B2 patent drawing

AI summary

Insulating properties between a metallic member supporting a power semiconductor module and an input/output terminal of the power semiconductor module are secured. In a power conversion device in which a bus bar of a connecting member is connected to an input/output terminal and the like of a semiconductor module protruding through an opening of a metallic member, the connecting member includes extended portions which extend in a space between the bus bar and the opening of the metallic member.