Power Conversion Apparatus Galvanic Isolation Board Area
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power conversion apparatuses face challenges in achieving sufficient galvanic isolation between power supply circuits while minimizing board area and manufacturing costs, as increasing separation distance between power supply circuits leads to increased board area and costs, hindering miniaturization.
Innovation Solution
A power conversion apparatus with a dual-active-bridge bidirectional DC-DC converter configuration, where semiconductor switching elements are driven by gate driving portions that include isolated power supply circuits converting AC power to DC power, allowing for efficient galvanic isolation and reduced board area by mounting driving and power conversion circuits on the same board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the separation distance between power supply circuits is increased to achieve sufficient galvanic isolation, then electrical isolation between power supply portions is improved, but board area increases
Solution Approach 1:
The patent introduces a ground isolation structure as an intermediary element between adjacent power supply circuits. This ground isolation structure includes a ground potential fixing portion connected to ground and extending in the first direction, and a ground potential fixing portion connected to ground and extending in the second direction. These ground potential fixing portions create equipotential zones that effectively isolate adjacent power supply circuits electrically while allowing them to be placed close together on the board, thus resolving the contradiction between achieving galvanic isolation and minimizing board area.
2Reliability
If the separation distance between power supply circuits is increased to ensure safety, then electrical isolation is improved, but manufacturing cost increases
Solution Approach 1:
The ground isolation structure serves as an effective and cost-efficient intermediary solution. Rather than requiring expensive alternative isolation methods or accepting larger board areas, the patent uses strategically placed ground potential fixing portions that create electrical isolation through equipotential zones. This approach provides sufficient galvanic isolation for safety while maintaining compact board layouts, thereby reducing manufacturing costs associated with larger boards or more complex isolation mechanisms.
3Area of stationary object
If power supply circuits are placed closer together for miniaturization, then board area is reduced, but electrical isolation between power supply circuits deteriorates
Solution Approach 1:
The ground isolation structure acts as an intermediary that enables close placement of power supply circuits while maintaining electrical isolation. The ground potential fixing portions extend in perpendicular directions (first and second directions) to create a three-dimensional equipotential barrier between adjacent power supply circuits. This allows the circuits to be positioned closer together for miniaturization without compromising galvanic isolation, as the ground isolation structure effectively blocks electrical interference between them.
Solution Approach 2:
The patent employs a three-dimensional ground isolation structure that extends in multiple directions (first direction and second direction perpendicular to each other) to create equipotential zones. By utilizing spatial dimensions rather than relying solely on increased separation distance in one direction, the patent achieves effective electrical isolation while maintaining compact board area, thus resolving the contradiction between miniaturization and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables secure galvanic isolation between power supply portions while minimizing board area, allowing for the miniaturization of power conversion apparatuses and preventing output signal interference.
Implementation Method 1
a power supply portion which converts AC power-supply power input from outside the first board into DC power-supply power
Data Source
AI summary
A power conversion apparatus includes a power conversion circuit portion which includes a plurality of semiconductor switching elements, a control signal generation portion which generates a control signal for controlling opening and closing of each of the semiconductor switching elements, a plurality of driving portions which drive the semiconductor switching elements, and a first board on which the power conversion circuit portion and the plurality of driving portions are mounted. Each of the driving portions includes a power supply portion which converts AC power-supply power input from outside the first board into DC power-supply power, and a driving signal generation portion which generates a driving signal for driving the semiconductor switching elements from the DC power-supply power in accordance with the control signal.