Power Conversion Package Module Thermal Dissipation
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Solution Overview
Problem
Conventional power converter semiconductor packages face challenges with heat dissipation, leading to space requirements on system boards and increased production costs due to mold limitations and inefficient heat transfer.
Innovation Solution
A package module for power conversion circuits with a substrate having a metal layer, insulating substrate layer, and thermal conductive layer, where pins are embedded in the molding layer and electrically coupled to the metal layer, allowing for separate heat dissipation and electrical coupling, reducing the need for specialized molds and minimizing heat transfer to the system board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the die is surface-mounted on the lead frame and heat is dissipated onto the system board through the lead frame, then the package structure is simple and the package size is small, but the heat dissipation performance is poor and it impedes the function of other components on the system board
Solution Approach 1:
The patent segments the heat dissipation function from the electrical connection function by introducing a separate heat dissipation substrate. The lead frame retains only electrical connection pins, while a dedicated heat dissipation substrate with thermal conductive layer handles heat dissipation, resolving the contradiction between simple structure and poor heat dissipation.
Solution Approach 2:
The patent introduces a heat dissipation substrate as an intermediary component between the die and the system board. This substrate includes a thermal conductive layer that provides a dedicated heat dissipation path, preventing heat from directly affecting other components on the system board while maintaining structural simplicity.
2Ease of operation
If the pin of the lead frame is disposed outside of molding compound, then the electrical connection is achieved, but the system space is not saved and a specialized mold is required for each module size increasing production costs
Solution Approach 1:
The patent merges the electrical connection pins with the molding compound by embedding the pins within the molding material. This integration eliminates the need for separate external pins, saving system space while maintaining electrical connection functionality through the molded-in pin structure.
Solution Approach 2:
The patent creates a universal mold design where the molding compound serves multiple functions: it provides structural support, electrical insulation, and houses the embedded pins. This multi-functional approach allows the same mold design to be used across different module sizes, reducing production costs.
3Ease of operation
If the pin of the lead frame is disposed outside of molding compound, then the electrical connection is achieved, but a new mold has to be replaced when the size of the module is changed increasing production costs
Solution Approach 1:
The patent creates a universal mold design where the molding compound serves multiple functions: it provides structural support, electrical insulation, and houses the embedded pins. This multi-functional approach allows the same mold design to be used across different module sizes, reducing production costs.
Solution Approach 2:
The patent performs preliminary integration of the pins within the molding compound during the molding process itself. By embedding the pins in advance rather than adding them later, the design allows for easier mold changes and reduces the need for specialized fixtures, lowering production costs.
4Volume of moving object
If the package size becomes smaller to achieve high power density, then the compact dimension and light weight are achieved, but the requirement for heat dissipation is growing higher
Solution Approach 1:
The patent addresses the heat dissipation challenge in compact packages by transitioning to a three-dimensional heat dissipation architecture. The heat dissipation substrate with its thermal conductive layer provides vertical heat paths, allowing efficient heat removal from the small-volume die without increasing the overall package footprint.
Solution Approach 2:
The patent introduces a heat dissipation substrate as an intermediary component between the die and the system board. This substrate includes a thermal conductive layer that provides a dedicated heat dissipation path, preventing heat from directly affecting other components on the system board while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, reduces space requirements on system boards, and lowers production costs by allowing for more efficient use of package space and universal mold design.
Implementation Method 1
the thermal conductive layer of the substrate dissipates heat of devices coupled to the metal layer
Data Source
AI summary
The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.