Power Conversion Device Multilayer Substrate Solid Via Impedance
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Solution Overview
Problem
Power conversion devices face challenges in reducing impedance and achieving miniaturization while maintaining fine wiring, especially when both power conversion and control circuits are integrated on a common substrate, as thickening the power wiring to reduce impedance can lead to unsuitable wiring widths and gaps for control circuits.
Innovation Solution
A power conversion device utilizing a multilayer substrate with power wiring patterns in different layers connected by solid-shaped conductive members, known as solid vias, which reduces impedance without thickening the wiring, allowing for both reduced heat generation and fine control wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the power wiring thickness is increased to reduce impedance, then the impedance is reduced and heat generation is minimized, but the wiring width and gap become unsuitable for control circuits requiring fine wiring
Solution Approach 1:
The patent transitions from a single-layer substrate to a multilayer substrate structure, moving the power wiring to a different layer than the control wiring. This dimensional change allows power wiring to be made thicker for lower impedance without affecting the fineness of control wiring on other layers, effectively resolving the contradiction between reducing heat generation and maintaining wiring fineness.
2Area of stationary object
If both power conversion circuit and control circuit are integrated on one common substrate, then the installation space is reduced and device is miniaturized, but the power wiring thickness cannot be increased without affecting control wiring
Solution Approach 1:
By utilizing a multilayer substrate structure, the patent separates power wiring and control wiring into different layers. This allows both circuits to be integrated on a compact common substrate while maintaining thick power wiring for low impedance and fine control wiring, thus achieving miniaturization without compromising energy efficiency.
Solution Approach 2:
The substrate is segmented into multiple layers with distinct functions: one layer for power wiring and another layer for control wiring. This segmentation enables independent optimization of each wiring type, allowing thick power wiring for low heat generation while maintaining fine control wiring for precise signal transmission, all within a compact integrated structure.
3Loss of energy
If the power wiring thickness is increased, then the impedance is reduced, but the device size increases and miniaturization is compromised
Solution Approach 1:
The patent resolves the contradiction between reducing impedance and minimizing device size by moving thick power wiring to a separate layer in a multilayer substrate structure. This allows the power wiring to have sufficient thickness for low impedance without increasing the overall device footprint, as the additional layering occurs in the vertical dimension rather than expanding the horizontal area.
Data Source
AI summary
A power conversion device comprise: a power conversion circuit that is configured to convert a supplied electric power to output the converted power; a control circuit that is configured to control an operation of the power conversion circuit; a multilayer substrate that has a different layers, power wiring patterns of the power conversion circuit and a control wiring pattern of the control circuit being arranged on the multilayer substrate, the power wiring patterns being disposed in different layers of the multilayer substrate; a via that extends across the power wiring patterns in the different layers; and a solid-shaped conductive member that is provided in the via to electrically connect the respective power wiring patterns to each other.