Electric Power Conversion System Thermal Management
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Solution Overview
Problem
Conventional electric power conversion systems face challenges in achieving efficient cooling while miniaturizing the system, leading to increased temperature risks and reduced component lifespan due to inadequate heat management and insufficient cooling of the logical block.
Innovation Solution
The system incorporates power semiconductors with cooling fins, a circuit board with a driver circuit, a casing with airflow holes for enhanced airflow, and a fan to direct air through these holes, facilitating improved heat dissipation and air circulation between the main circuit and logical block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the density of elements mounted on a circuit board is increased to implement miniaturization, then the system size is reduced, but cooling efficiency deteriorates and temperature inside the system increases
Solution Approach 1:
The system is divided into distinct thermal zones: the main circuit board area and the logical block area. A shielding member is positioned between these zones to segment the airflow path, allowing independent thermal management for each section. This segmentation enables the logical block to receive cooler air while the main circuit board can handle higher temperatures, thus maintaining cooling efficiency in a compact form factor.
Solution Approach 2:
Different regions of the system are provided with different thermal characteristics. The logical block area is positioned to receive air that has not yet been heated by the main circuit board, creating a local cool zone. The shielding member ensures that this local quality (cool air supply) is maintained specifically where needed, while other areas can tolerate higher temperatures.
2Reliability
If a shielding member is provided between the main circuit and logical block to prevent heat transfer, then thermal insulation is improved, but cooling of the logical block itself becomes insufficient
Solution Approach 1:
An air duct is introduced as an intermediary structure between the main circuit board and the logical block. This air duct serves multiple functions: it provides a dedicated cooling path for the logical block, allows the shielding member to perform thermal insulation, and ensures that cool air reaches the logical block without being heated by the main circuit board. The air duct acts as a mediator that resolves the conflict between insulation and cooling.
Solution Approach 2:
The air duct segments the airflow path into distinct channels: one for cooling the main circuit board and another for cooling the logical block. This segmentation allows each component to receive appropriately cooled air without interfering with the other, maintaining both thermal insulation between components and sufficient cooling for each.
3Temperature
If air cooling is enhanced through natural convection, then cooling efficiency is improved, but system complexity increases
Solution Approach 1:
The system utilizes natural convection currents to achieve cooling without requiring complex active cooling mechanisms. The air duct and shielding member are positioned to take advantage of natural air flow patterns, where heated air rises and cooler air replaces it, creating a self-sustaining cooling circulation. This self-service approach improves cooling efficiency while avoiding the need for additional fans, pumps, or complex control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling performance, allowing for miniaturization without overheating, thereby extending component lifespan and improving system reliability and efficiency.
Implementation Method 1
heat from the power semiconductors, acting as heating elements, is conducted to the cooling fins, and air is sent out to the cooling fins by the cooling fan to cause heat exchange to take place
Implementation Method 2
a fan for causing the air from the circuit board to flow to the fins through the airflow hole
Implementation Method 3
The main circuit side of a system is respectively made up of an insulation material 9 while the logical block of the system is made up of a steel sheet 8 or the like
Data Source
AI summary
In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.