Power Conversion Device Thermal Management via Through-Hole Cooler
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Solution Overview
Problem
Conventional power conversion devices face challenges in noise reduction, heat dissipation, and downsizing due to increased connection impedance and complex design requirements, which also lead to inefficiencies and increased costs.
Innovation Solution
A power conversion device with a main circuit featuring first and second wiring layers on both surfaces of a base board, GND layers between these layers, and a cooler attached through through-holes, creating heat-dissipation paths and reducing noise resistance by optimizing the placement and thickness of GND layers and wiring layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the copper-foil thickness of the wiring layer is increased or the number of wiring layers is increased to decrease the wiring impedance, then the current carrying capacity is improved, but the manufacturing cost and device complexity increase
Solution Approach 1:
The patent utilizes the thickness dimension of the base board itself as a heat dissipation path by forming through-holes that penetrate the board and attaching a cooler to the rear surface. This three-dimensional heat dissipation approach complements the planar wiring layers, allowing effective heat removal without increasing the number of copper layers or their thickness.
Solution Approach 2:
The patent introduces a cooler as an intermediary heat dissipation component attached to the rear surface of the base board. This cooler acts as a mediator that captures heat from the internal heat-generating components through the through-holes and rear surface, enabling effective thermal management without modifying the wiring layer structure.
2Reliability
If a terminal block is interposed between the internal-layer GND pattern and the housing to establish GND connection, then the connection is established, but the connection impedance increases and noise is generated
Solution Approach 1:
The patent extracts and eliminates the terminal block from the GND connection path. By directly connecting the internal-layer GND pattern to the housing through through-holes formed in the base board, the intermediate component that caused impedance and noise is removed, achieving a cleaner GND connection.
Solution Approach 2:
The patent replaces the mechanical terminal block connection system with a direct structural connection through the base board. The through-holes provide a more direct and lower-impedance electrical path from the GND pattern to the housing, substituting the multi-component mechanical connection with a simplified structural integration.
3Reliability
If the terminal block ensures amounting area twice the area for the fixing screw(s), then the GND connection is ensured, but the product size is restricted and downsizing is prevented
Solution Approach 1:
The patent merges the GND connection function with the base board structure itself. The through-holes are formed directly in the base board, integrating the connection path into the existing structural component. This eliminates the need for separate terminal blocks and their associated mounting areas, enabling product downsizing while maintaining reliable GND connection.
Solution Approach 2:
The base board is given multiple functions: it serves as both the structural support and as the medium for establishing GND connections through its through-holes. This multi-functionality eliminates the need for dedicated terminal block mounting areas, reducing overall product size while maintaining connection reliability.
4Temperature
If special-form parts are fixed to heatsink using conventional mounting structure, then heat dissipation is achieved, but the screw may be broken, the special-form part may be deformed, or the special-form part may be peeled off from the heatsink
Solution Approach 1:
The patent transitions from surface-mounted heat dissipation to three-dimensional heat dissipation by forming through-holes that penetrate the base board and attaching the cooler to the rear surface. This allows heat to be conducted from the internal components through the board thickness to the cooler, providing robust thermal management without relying on fragile surface mounting of special-form parts.
5Adaptability or versatility
If a circuit board with general electronic parts is placed contiguously to the circuit module, then integration is achieved, but it is difficult to place due to the conventional mounting structure
Solution Approach 1:
The patent extracts the cooler attachment from the conventional terminal block mounting structure. By using through-holes formed in the base board rather than surface-mounted terminal blocks, the mounting structure is simplified, creating space and flexibility for placing circuit boards contiguously to the circuit module, thereby improving integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, reduces noise resistance, and achieves downsizing while lowering board costs by allowing larger current flow without increasing the number of layers or copper thickness, thereby improving overall efficiency and noise resistance performance.
Implementation Method 1
a measure for heat dissipation has been taken by providing such a structure that directly or indirectly cools the wiring layers to thereby create thermal paths
Implementation Method 2
a cooler attached to a base board by means of fixing screws through first through-holes created in an end portion of the base board
Data Source
AI summary
The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.