Electric Power Conversion Apparatus Vibration Resistance
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Solution Overview
Problem
Existing electric power conversion apparatuses face challenges in maintaining cooling efficiency due to vibrations, which displace electronic components relative to cooling pipes, and the use of multiple pressure-applying members increases size and complexity.
Innovation Solution
The apparatus incorporates a semiconductor module-cooler unit, a flow path forming component, and a pressure-applying member, where the flow path forming component is fixed to the case, eliminating the need for pressure application between electronic components and cooling paths, allowing the pressure-applying member to focus on the semiconductor module-cooler unit, thereby enhancing cooling efficiency and minimizing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure-applying members are used on both sides of the semiconductor module-cooler unit to maintain cooling efficiency during vibrations, then cooling efficiency is improved, but the device size and complexity increase
Solution Approach 1:
The patent merges the functions of two separate pressure-applying members into a single pressure-applying member located at the rear side. This is achieved by fixing the flow path forming component to the case, which allows the single pressure-applying member to effectively maintain contact between the semiconductor module-cooler unit and cooling pipes throughout the stacking direction, thereby reducing device complexity while maintaining cooling efficiency
Solution Approach 2:
The flow path forming component is fixed to the case in advance, creating a stable reference structure. This preliminary fixation allows the single pressure-applying member to effectively transmit pressure through the stacked body without requiring additional pressure-applying members, as the fixed flow path forming component provides structural stability that prevents displacement during operation
2Device complexity
If electronic components are allowed to displace during vibrations, then device simplicity is maintained, but cooling efficiency deteriorates
Solution Approach 1:
The pressure-applying member applies preliminary pressure to the semiconductor module-cooler unit from the rear side, creating a pre-compressed state that counteracts the effects of vibrations. This preliminary anti-action prevents displacement of electronic components relative to cooling pipes during operation, maintaining cooling efficiency without requiring complex vibration damping structures
Solution Approach 2:
The patent segments the pressure application function by fixing the flow path forming component to the case, which serves as a stable reference. This segmentation allows the pressure-applying member to focus on maintaining contact in the semiconductor module-cooler unit without needing to address the entire assembly, thereby simplifying the overall structure while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves vibration resistance and cooling efficiency while reducing the overall size of the apparatus by eliminating the need for dual pressure-applying members and integrating coolant paths, facilitating a more compact design.
Implementation Method 1
the electronic components (i.e., the semiconductor modules and the reactor) are brought into intimate contact with the cooling pipes of the cooler, thereby improving the efficiency of cooling the electronic components by the cooler
Implementation Method 2
The in-component flow path, through which a coolant flows to cool the electronic component main body
Implementation Method 3
an in-cooler flow path, which is formed in the cooler, and the in-component flow path are fluidically connected with each other
Data Source
AI summary
In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.