Power Converter Cooling Layout for Capacity Module Heat Dissipation
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Solution Overview
Problem
High-power power conversion devices face challenges in effectively dissipating heat generated by semiconductor and capacity modules, leading to thermal interference and increased size and weight, which complicates cooling and affects fuel efficiency in vehicles.
Innovation Solution
A power conversion device design featuring a first cooler for the capacity module, a second cooler for the semiconductor module, and a heat dissipation plate that shares a refrigerant flow path, allowing heat from the capacity module to be dissipated through two pathways to prevent thermal interference and reduce size and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor cooler is extended and the capacity module is mounted on the semiconductor cooler, then the heat dissipation pathway is increased, but the heat of the capacity module thermally interferes with the capacity module via the semiconductor cooler, so that the capacity module is not sufficiently cooled, and the semiconductor cooler is increased in size
Solution Approach 1:
The cooling system is divided into two separate coolers: a first cooler specifically for the capacity module and a second cooler for the semiconductor module. This segmentation prevents thermal interference between the two modules while maintaining efficient heat dissipation for each, avoiding the need to extend a single cooler which would cause thermal interference and size increase.
Solution Approach 2:
A heat dissipation plate is introduced as an intermediary component between the capacity module and the second cooler (semiconductor cooler). This plate provides an additional heat dissipation pathway for the capacity module without requiring direct mounting on the semiconductor cooler, thus preventing thermal interference while enhancing cooling capability.
2Temperature
If two cooling systems are installed (capacity module cooler and semiconductor module cooler disposed separately), then thermal interference is prevented, but the configuration becomes complicated and weight increases
Solution Approach 1:
The first cooler (capacity module cooler) and the second cooler (semiconductor module cooler) are merged into a single integrated cooler assembly that houses both cooling systems. This merging allows the two separate cooling pathways to coexist in a compact structure, preventing thermal interference while avoiding the weight and space penalties of completely separate cooling systems.
Solution Approach 2:
The heat dissipation plate and second cooler are positioned within or adjacent to the first cooler structure, creating a nested arrangement. This nesting allows the capacity module to have access to two cooling pathways (direct cooling via first cooler and indirect cooling via heat dissipation plate to second cooler) without requiring a fully separate cooling system, thus reducing overall weight and complexity.
3Temperature
If the heat exchanger plate is connected close to the capacity module, then heat dissipation pathway is provided, but thermal interference with the capacity module occurs via the semiconductor cooler, reducing cooling effectiveness
Solution Approach 1:
The cooling system is designed with different local cooling characteristics: the first cooler provides direct cooling to the capacity module, while the second cooler (accessed via the heat dissipation plate) provides indirect cooling. This local differentiation allows heat to be dissipated through two distinct pathways with different thermal characteristics, preventing thermal interference while maintaining high cooling effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat from the capacity module, preventing temperature rises and reducing the size and weight of the power conversion device, thereby enhancing cooling efficiency and fuel economy.
Implementation Method 1
a heat dissipation plate which, being thermally connected to the capacity module and to the second cooler, dissipates via the second cooler one portion of the heat generated from the capacity module
Implementation Method 2
the first and second coolers, being disposed so as to form a refrigerant flow path, both share a refrigerant
Data Source
AI summary
To obtain a power conversion device reduced in size and weight wherein heat generated from a capacity module is sufficiently dissipated, thus enabling prevention of a rise in the temperature of the capacity module. The power conversion device includes a first cooler which, having mounted thereon the capacity module, cools heat generated from the capacity module; a second cooler which, having mounted thereon a semiconductor module, cools heat generated from the semiconductor module; and a heat dissipation plate which, being thermally connected to the capacity module and to the second cooler, dissipates via the second cooler one portion of the heat generated from the capacity module, wherein the first and second coolers, being disposed so as to form a refrigerant flow path, both share a refrigerant.