Power Converter Package Structure With Low-Resistance Common Node
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Solution Overview
Problem
Existing power converter package structures face challenges in miniaturization and integration, leading to increased chip area and high switching losses due to the need for external connections and potential interference between power transistors and control circuits.
Innovation Solution
A package structure that integrates a first die with a power transistor and control circuit, and a second die with a separate power transistor, connected through a metal connection structure with low interconnection resistance, allowing for high-frequency switching and reduced losses, while maintaining reliability by avoiding interference between the transistors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power transistors and control circuits are integrated on the same chip, then device complexity is reduced, but chip area increases and interference between components occurs
Solution Approach 1:
The patent divides the power converter into separate functional modules: power transistors on one die and control circuits on another die, connected through a substrate. This segmentation reduces interference between high-power and low-power components while maintaining integration benefits, directly resolving the contradiction between reduced complexity and increased chip area.
2Ease of manufacture
If external connections are used to connect power transistors, then manufacturing is simplified, but switching losses increase due to higher resistance
Solution Approach 1:
The patent merges the connection function into the substrate itself, which provides low-resistance electrical pathways between power transistors and control circuits. This eliminates the need for high-resistance external wire bonds while maintaining manufacturing simplicity, thereby reducing switching losses without sacrificing ease of manufacture.
3Ease of operation
If multiple power transistors are connected externally, then device assembly is easier, but conduction losses increase due to higher on-resistance
Solution Approach 1:
The substrate acts as an intermediary between multiple power transistors, providing optimized electrical pathways that minimize resistance. This mediator structure reduces conduction losses compared to direct external connections while maintaining assembly ease through standardized substrate interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed package structure enhances operating frequency, reduces switching losses, and improves reliability by eliminating the need for external connections and minimizing on-resistance and conduction losses, thereby optimizing power converter performance.
Implementation Method 1
a common connection node of the first and second power transistors can be coupled to an output pin of the lead frame through a metal connection structure with a low interconnection resistance
Data Source
AI summary
A package structure applied to power converters can include: a first die having a first power transistor and a first control and drive circuit; a second die having a second power transistor; a connection device configured to couple the first and second power transistors in series between a high-level pin and a low-level pin of a lead frame of the package structure; and where a common node of the first and second power transistors can be coupled to an output pin of the lead frame through a metal connection structure with a low interconnection resistance.