Power Converter Coolant Flow Control via Integrated Protrusions

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Solution Overview

Problem

Existing power converter designs face challenges in suppressing coolant bypassing, which reduces coolability, while also complicating the installation of flow path control members, thereby impacting productivity.

Innovation Solution

The design incorporates a power semiconductor module with fins and a flow path forming body featuring overlapping coolant control units that guide the coolant flow to prevent bypassing, enhancing both coolability and productivity by integrating the flow path control without the need for additional installation components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a flow path control member is installed between a fin and a frame body to suppress coolant bypassing, then coolability is improved, but productivity deteriorates due to difficult automation of installation

Engineering Contradiction:
ImprovecoolabilityVSAvoidproductivity
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The flow path control function is merged with the flow path forming body by forming protrusions directly on the flow path forming body. This eliminates the need for separate flow path control members and their installation processes, thereby improving productivity while maintaining the coolant bypassing suppression function that enhances coolability.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If additional flow path control members are added to prevent coolant bypassing, then coolability is improved, but device complexity increases

Engineering Contradiction:
ImprovecoolabilityVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The flow path control function is integrated into the flow path forming body through protrusions, eliminating the need for additional separate components. This reduces device complexity while maintaining the ability to suppress coolant bypassing and improve coolability.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively suppresses coolant bypassing, improving the coolability and productivity of power converters by simplifying the assembly process and reducing the number of components required.

Implementation Method 1

a first fin (343a) formed on one surface (354) and a second fin (343b) formed on another surface (355) which faces the one surface so as to sandwich the semiconductor element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a flow path (441) in which the power semiconductor module is disposed and an opening (451) which is connected with the flow path

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a first coolant control unit (471) and a second coolant control unit (472) which are disposed so as to sandwich the first fin (343a)

Methodology Applied
Scientific EffectFluid flow control:

Data Source

PatentUS10279653B2Power converter
Publication Date: 2019.05.07 ASTEMO LTD
  • US10279653B2 patent drawing
  • US10279653B2 patent drawing
  • US10279653B2 patent drawing

AI summary

The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity.The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.