Power Converter With Five-Side Connections for PCB Simplification
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Solution Overview
Problem
Half-bridge semiconductor packages for power electronics often require complex connections due to multiple conductive paths, which can complicate the design and attachment to printed circuit boards (PCBs), especially when aiming for higher power density and frequency operations.
Innovation Solution
The integration of a device comprising a first and second vertical power transistor with an inductor, where the inductor terminal is electrically connected to the transistors, and at least five electrical connections are strategically placed on one side to simplify connections and enhance thermal dissipation, allowing for easier attachment to PCBs and improved design efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple conductive paths are used to connect transistors and inductor terminals, then electrical connectivity is improved, but device complexity and connection difficulty increase
Solution Approach 1:
The patent combines multiple electrical connections (at least five connections including control terminals, drain terminals, source terminals, and inductor terminals) onto a single side of the semiconductor package. This merging of connections to one side eliminates the need for complex inter-side routing and simplifies PCB attachment while maintaining all necessary electrical connectivity paths for the half-bridge circuit operation.
Solution Approach 2:
The single side of the semiconductor package serves multiple functions simultaneously: it provides all electrical connections for both transistors, inductor terminals, and control signals. This multi-functional design allows the package to maintain complex electrical connectivity while presenting a simplified external interface for PCB mounting.
2Ease of manufacture
If conventional semiconductor packages are used, then manufacturing is simplified, but thermal dissipation and connection efficiency are reduced
Solution Approach 1:
The patent transitions from conventional multi-side connection architectures to a single-side connection architecture. This dimensional reorganization concentrates all electrical connections and thermal pathways on one side, improving both thermal dissipation efficiency and connection efficiency while maintaining manufacturing feasibility through standard semiconductor packaging processes.
3Reliability
If connections are distributed on multiple sides, then electrical connectivity is achieved, but attachment to PCB becomes complicated
Solution Approach 1:
All electrical connections (control terminals, drain terminals, source terminals, and inductor terminals) are merged and positioned on a single side of the semiconductor package. This consolidation allows the entire package to be attached to the PCB in one operation, eliminating the complexity of multi-side attachment while preserving complete electrical connectivity for the half-bridge circuit.
Data Source
AI summary
In some examples, a device comprises an integrated circuit comprising a first transistor and a second transistor. The device further comprises an inductor comprising a first inductor terminal and a second inductor terminal, wherein the first inductor terminal is electrically connected to the first transistor and the second transistor. The device further comprises at least five electrical connections on a first side of the device.