Power Converter Lead Frame Bending for Compact Assembly

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Solution Overview

Problem

The existing rotary electric machines require larger housings due to the need for tools to join third lead frames and signal connectors inside the housing, leading to increased size and potential for interference, which complicates manufacturing and assembly.

Innovation Solution

A power converter design with semiconductor modules and cooler configurations that allow outer lead frames and connector leads to be bent and joined outside the housing, using a cap member and resin filler to cover and secure these connections, eliminating the need for a larger housing opening and enabling a more compact size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the third lead frames are joined to the signal connectors inside the housing, then the electrical connection is established, but the housing area increases to accommodate joining tools

Engineering Contradiction:
Improveelectrical connectionVSAvoidhousing area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent inverts the conventional joining location from inside the housing to outside the housing. The third lead frames are drawn out from the housing and joined to signal connectors externally, eliminating the need for internal joining space. This allows the housing to be more compact while maintaining reliable electrical connections.

Inventive Principle:
Principle #13The other way round (Inversion)

2Ease of manufacture

If the housing is upsized to prevent tool interference, then the assembly process is simplified, but the overall device size increases

Engineering Contradiction:
Improveassembly processVSAvoiddevice volume
Core Design Contradiction:
Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent extracts the joining operation from the housing interior to the exterior environment. By drawing out the third lead frames and performing connections outside the housing, the joining process becomes accessible to standard tools without requiring enlarged housing openings, thus maintaining compact device volume while ensuring ease of manufacture.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If the lead frames are drawn out and bent to project from the housing, then the connection point is accessible, but the device complexity increases

Engineering Contradiction:
Improveconnection accessibilityVSAvoidlead frame configuration
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent utilizes spatial dimensionality by drawing lead frames out from the housing in a direction perpendicular to the housing surface and bending them to project outward. This three-dimensional configuration makes connection points accessible from the exterior while efficiently using available space, avoiding the need for complex internal routing or enlarged housing structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration results in a smaller size for both the power converter and rotary electric machine, improving manufacturing efficiency and reducing the risk of interference during assembly, while maintaining effective heat transfer and electrical connections.

Implementation Method 1

a cooler disposed to be directly or indirectly in surface contact with the predetermined surface of the semiconductor module

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10396636B2Power converter and rotary electric machine
Publication Date: 2019.08.27 DENSO CORP
  • US10396636B2 patent drawing
  • US10396636B2 patent drawing
  • US10396636B2 patent drawing

AI summary

In a power converter, outer lead frames are drawn out from a semiconductor module and are bent to be separated from a cooler. Each of the outer leads has a terminal end. The terminal end of each outer lead frame projects from a virtual plane extending along a second surface of a housing. Connector leads each includes an inner portion disposed in the housing, and an outer portion drawn out from the housing and bent to be separated from the cooler. The outer portion of each connector lead has a terminal end. The terminal end of the outer portion of each connector lead projects from the virtual plane.