Power Converter Vibration Resistance via Planar Module Overhang Reduction

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Solution Overview

Problem

Existing power converters face issues with low vibration resistance and increased volume due to signal pin interference and brittleness, as well as low accuracy in current sensing caused by long wiring picking up noise.

Innovation Solution

A power converter design featuring planar semiconductor modules with resin sealing, a cooler with refrigerant tube parts, and a cover that supports the resin sealing and cooler in proximity, with conductive members and signal terminals protruding away from the cover to reduce overhang, along with a current sensor and control board connected by a shortened harness to minimize noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If signal pins extend from one side of the power module and bus bars extend from the other side, then connections can be established, but the overhang amount increases and vibration resistance decreases

Engineering Contradiction:
Improvevibration resistanceVSAvoidoverhang amount
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent transitions from a planar arrangement where signal pins and bus bars extend in opposite directions (increasing overhang) to a three-dimensional arrangement where both extend from the same side of the power module. This dimensional change allows both connection types to be compactly arranged near the module edge, reducing the overhang amount and improving vibration resistance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If signal pins and bus bars are arranged with maximum separation, then interference is reduced, but the wiring distance increases and noise pickup increases

Engineering Contradiction:
Improvecurrent sensor accuracyVSAvoidwiring distance
Core Design Contradiction:
Measurement precisionVSLength of stationary object

Solution Approach 1:

The patent merges the exit positions of signal pins and bus bars to the same side of the power module, allowing the current sensor and control board to be positioned nearby. This consolidation reduces the wiring distance significantly while maintaining proper electrical isolation through the resin sealing part, thereby reducing noise pickup and improving measurement precision.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If power modules are held in a traditional configuration, then assembly is straightforward, but the modules may deviate from normal positions and break due to vibration

Engineering Contradiction:
Improvemodule stabilityVSAvoidholding structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The holding structure is segmented into multiple support portions that independently hold different components (power modules, current sensors, control board) at optimized positions. This segmentation allows each component to be securely positioned with minimal overhang, improving overall stability and vibration resistance while maintaining assembly simplicity through modular support elements.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10284105B2Power converter
Publication Date: 2019.05.07 HONDA MOTOR CO LTD
  • US10284105B2 patent drawing
  • US10284105B2 patent drawing
  • US10284105B2 patent drawing

AI summary

A power converter (1) includes: planar semiconductor modules (10) each having a resin sealing part (16) in which a semiconductor element (11), conductive members (12, 13, and 14), and a signal terminal (15) are sealed with a resin; a cooler (20) that holds the plurality of semiconductor modules (10) in a laminated manner; and a cover (30) that covers the semiconductor modules and the cooler, wherein at least a part of the resin sealing part (16) and the cooler (20) are supported by support media (41 and 42) that extend from the cover (30) so that facing parts of the resin sealing part and the cooler with respect to the cover (30) is positioned in proximity to the cover, and the conductive members and the signal terminal protrude from the resin sealing part in a direction away from the cover.