Multi-phase Power Converter Shared Conductive Element Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Half-bridge circuits in power converters face challenges with complex connections and high parasitic capacitances due to multiple conductive paths, which complicate design and increase costs, especially in high-power and high-frequency applications.
Innovation Solution
The solution involves electrically connecting a single conductive element to the input nodes and another to the reference nodes of semiconductor dies, each comprising power transistors, with die paddles isolated from each other to reduce parasitic capacitances and simplify the design by shortening conductive paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple conductive paths are used to connect contacts in half-bridge circuits, then connectivity and functionality are improved, but parasitic capacitances increase and design complexity increases
Solution Approach 1:
The patent merges multiple conductive paths into a single shared conductive element that connects to multiple input nodes of semiconductor dies. This consolidation maintains electrical connectivity to all required nodes while eliminating the parasitic capacitances that would arise from multiple separate conductive paths, directly resolving the contradiction between connectivity and parasitic capacitance.
Solution Approach 2:
The shared conductive element serves multiple functions simultaneously by connecting to multiple input nodes of different semiconductor dies. This single element replaces what would traditionally require multiple separate conductive paths, achieving universal connectivity while minimizing parasitic effects.
2Reliability
If multiple conductive paths are used in half-bridge circuits, then connectivity is improved, but design complexity and fabrication complexity increase
Solution Approach 1:
The patent combines multiple conductive paths into one shared conductive element, significantly simplifying the design and fabrication process. This merging approach maintains full connectivity to all semiconductor die input nodes while reducing the number of conductive elements that need to be designed, manufactured, and assembled.
3Reliability
If multiple conductive paths are used in half-bridge circuits, then connectivity is improved, but fabrication complexity and costs increase
Solution Approach 1:
The patent merges multiple conductive paths into a single shared conductive element, making fabrication easier and reducing manufacturing costs. This approach requires fewer materials, simpler assembly processes, and less complex quality control, while still providing the necessary connectivity to all semiconductor die input nodes.
Data Source
AI summary
In some examples, a device comprises at least two semiconductor die, wherein each respective semiconductor die of the at least two semiconductor die comprises at least two power transistors, an input node on a first side of the respective semiconductor die, a reference node on the first side of the respective semiconductor die, and a switch node on a second side of the respective semiconductor die. The device further comprises a first conductive element electrically connected to the respective input nodes of the at least two semiconductor die. The device further comprises a second conductive element electrically connected to the respective reference nodes of the at least two semiconductor die.