Power Converter Spring Pressing for Semiconductor Adhesion

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Solution Overview

Problem

Existing electric power converters face issues with deformation during assembly or due to shape variations, leading to reduced adhesion between semiconductor modules and cooling pipes, which results in inadequate cooling and potential performance degradation.

Innovation Solution

The electric power converter design incorporates a supporting member with a pair of supporting wall portions and a connecting portion, where a large-sized semiconductor element with higher thermal resistance is placed at the connecting end portion for efficient cooling, and a small-sized semiconductor element is placed at the open end portion to minimize contact difficulties and reduce thermal resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If a spring member is used to press semiconductor modules and cooling pipes, then pressing force is applied to ensure contact, but the open side of the supporting member deforms and inclines, reducing adhesion between semiconductor modules and cooling pipes

Engineering Contradiction:

Improvepressing forceVSAvoidadhesion between semiconductor modules and cooling pipes

Core Design Contradiction:

ForceVSReliability

Solution Approach 1:

The invention applies different pressing forces to different regions by strategically placing semiconductor elements of varying sizes. Large-sized elements are positioned where greater pressing force is needed to compensate for lower adhesion, while small-sized elements are placed where less force is required. This local differentiation of element sizes creates a non-uniform pressing force distribution that compensates for the deformation-induced adhesion reduction at the open side.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention changes the parameter of semiconductor element size to control the pressing force characteristics. By using a mix of large-sized and small-sized semiconductor elements, the system adjusts the local pressing force parameters to compensate for the deformation of the supporting member, ensuring adequate adhesion across all regions despite the inclination caused by spring member compression.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If large-sized semiconductor elements are used, then thermal resistance is higher for better heat dissipation, but device size increases

Engineering Contradiction:

Improvethermal resistanceVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The invention applies different semiconductor element sizes to different locations within the device. Large-sized elements with higher thermal resistance are strategically placed in regions where maximum heat dissipation is required, while small-sized elements are used in other areas. This local differentiation optimizes thermal management without requiring the entire device to be oversized.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention uses large-sized semiconductor elements with higher thermal resistance only in specific regions where it is most needed, rather than uniformly across the entire device. This partial application of the large-element strategy achieves sufficient heat dissipation performance while minimizing the overall device size increase that would result from using large elements throughout.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances cooling efficiency by ensuring close contact at the connecting end portion while reducing the impact of reduced adhesion at the open end portion, allowing semiconductor modules to operate effectively and reducing costs through smaller semiconductor element sizes.

Implementation Method 1

a pressing member (6) that presses the semiconductor module (2) and the cooling pipe (41) in an overlapping direction (X)

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

a cooling pipe (41) disposed so as to overlap with the semiconductor module (2)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9502331B2Electric power converter with a spring member

Publication Date: 2016.11.22 DENSO CORP

AI summary

An electric power converter includes a semiconductor module, a cooling pipe, a pressing member and a supporting member. A pair of supporting wall portions is disposed so as to sandwich the semiconductor module, the cooling pipe, and the pressing member in an overlapping direction. A semiconductor element includes a small-sized semiconductor element, and a large-sized semiconductor element of which an outer shape is larger than that of the small-sized semiconductor element when projected onto a plane parallel to the overlapping direction. Within the semiconductor module, the large-sized semiconductor element is disposed closer to a connecting end portion side where a connecting portion of the pair of supporting wall portions are disposed than the small-sized semiconductor elements is.