Power Converter Module Staggered Copper Layers Parasitic Inductance
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Solution Overview
Problem
High-power power converter modules face efficiency losses due to parasitic inductance and AC losses in multilayer printed circuit boards, particularly as output power increases, leading to reduced conversion efficiency and larger size.
Innovation Solution
The solution involves staggering positive and negative copper layers on a substrate, with electrical connections to switching and capacitor terminals via vias, allowing partial overlap of adjacent copper layers and capacitor areas to reduce parasitic inductance and loss, thereby enhancing conversion efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If output power of power converter module increases, then higher power conversion capability is achieved, but current loop loss increases proportionally
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple copper layers with overlapping projections. This three-dimensional configuration reduces the effective loop area and parasitic inductance, allowing higher current transmission with reduced losses, thereby enabling increased output power without proportional increase in current loop loss.
2Productivity
If multiple copper layers are used to reduce equivalent impedance, then transmission efficiency improves, but device complexity increases
Solution Approach 1:
The patent simplifies the complex multi-layer connection problem by introducing a systematic overlapping projection configuration. Instead of complex lateral routing, the solution uses vertical stacking with controlled overlaps, making the multi-layer structure more manageable and manufacturable while maintaining transmission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces parasitic inductance and loss, improving the conversion efficiency of power converter modules by minimizing AC losses and allowing for a more compact design.
Implementation Method 1
The projections of the adjacent positive and negative copper layers and capacitor area on the first surface partially overlap with each other, thereby reducing the parasitic inductance of the wiring and reducing the parasitic loss
Data Source
AI summary
An apparatus includes a substrate, a switching device, a capacitor device, a first via, a second via, a third via and a fourth via. The substrate has a first surface and a second surface and includes a plurality of copper layers including M positive copper layers and N negative copper layers. The M positive copper layers and the N negative copper layers are alternated. The switching device is disposed on the first surface and includes a switching positive terminal and a switching negative terminal. The capacitor device is disposed on the first surface and includes a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor area. The projections of the adjacent positive and negative copper layers and the capacitor area on the first surface at least partially overlap with each other.