Power Converter Sub-Module Layout for Substrate Thermal Isolation

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Solution Overview

Problem

The substrate in a power conversion device is heated by the heat sources such as IGBTs and laminated bus bars when they are disposed in the same space, leading to thermal issues.

Innovation Solution

The power conversion device includes a housing frame and separation frames that separate the space for the drive circuits and substrates from the space for IGBTs and laminated bus bars, with cooling fins and openings for airflow to manage heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the substrate and heat sources (IGBT and laminated bus bar) are disposed in the same space, then the device structure is simplified, but the substrate is heated by the heat source

Engineering Contradiction:
Improvedevice structureVSAvoidsubstrate temperature
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The housing frame is divided into a first housing portion and a second housing portion that are separated by a predetermined distance, creating distinct spatial zones. The substrate is mounted on the first housing portion while heat sources are mounted on the second housing portion, physically segmenting the device to prevent thermal coupling between components.

Inventive Principle:
Principle #1Segmentation

2Temperature

If the substrate is isolated from heat sources, then substrate heating is suppressed, but the device structure becomes more complex

Engineering Contradiction:
Improvesubstrate temperatureVSAvoiddevice structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The housing frame serves multiple functions simultaneously: it provides structural support for mounting the substrate and heat sources, creates thermal isolation through spatial separation, and maintains electrical insulation. This multi-functionality achieves thermal management without adding separate dedicated cooling structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of energy

If cooling structures are added to the device, then heat dissipation is improved, but the device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The spatial separation of heat-generating components from heat-sensitive components enables passive thermal management. The device structure itself, through the separated housing portions, provides the cooling function without requiring active cooling systems, fans, or complex thermal management components.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses the heating of the substrates by isolating them from direct heat sources, improving thermal management and device performance.

Implementation Method 1

a separation frame for separating a space in which the drive circuit and the substrate are disposed from a space in which the IGBT and the laminated bus bar are disposed

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

the substrate and a heat source such as the IGBT and the laminated bus bar are disposed in the same space, the substrate is heated by the heat source

Methodology Applied
Scientific EffectHeat generation: Joule Heating

Data Source

PatentUS12451816B2Sub-module of power conversion device
Publication Date: 2025.10.21 TMEIC CORP
  • US12451816B2 patent drawing
  • US12451816B2 patent drawing
  • US12451816B2 patent drawing

AI summary

A sub-module of a power conversion device includes: an IGBT, a drive circuit that drives the IGBT, a laminated bus bar on which the IGBT is mounted; a substrate on which the drive circuit is mounted; a housing frame for accommodating the IGBT, the drive circuit, the laminated bus bar, and the substrate; and a separation frame for separating a space in which the drive circuit and the substrate are disposed from a space in which the IGBT and the laminated bus bar are disposed.