Power Converter Substrate Conductive Path Insulation
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Solution Overview
Problem
The installation of an insulating circuit in power converters hinders their downsizing, limiting their compactness and efficiency.
Innovation Solution
A power converter design that incorporates a semiconductor device with a control chip, a secondary power chip, and a transmission circuit for electrical insulation, utilizing a substrate with conductive paths and connecting terminals to reduce physical size while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating circuit is installed to electrically isolate the primary control circuit and secondary power circuit, then electrical insulation and safety are improved, but the device size increases and compactness deteriorates
Solution Approach 1:
The patent combines the insulating circuit with the substrate structure by forming conductive paths directly on the substrate surface. The substrate serves dual purposes: as the mounting platform for semiconductor devices and as the carrier for insulating conductive paths, eliminating the need for separate insulating components and reducing overall device volume.
Solution Approach 2:
The patent transitions from three-dimensional stacked insulation structures to two-dimensional planar conductive paths on the substrate surface. By utilizing the substrate surface area rather than vertical stacking, the design achieves electrical insulation while maintaining a compact footprint.
2Reliability
If a separate insulating circuit is used for signal transmission between primary and secondary circuits, then electrical isolation is maintained, but the number of components increases and device complexity worsens
Solution Approach 1:
The substrate performs multiple functions simultaneously: it mounts semiconductor devices, provides electrical connections through conductive paths, and ensures electrical isolation between primary and secondary circuits. This multi-functionality reduces the total component count while maintaining reliability.
Solution Approach 2:
The substrate acts as an intermediary element that enables both signal transmission and electrical isolation between the primary control circuit and secondary power circuit. By integrating the insulating function into the substrate itself, the patent eliminates the need for separate insulating components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a more compact power converter form factor without compromising electrical insulation and signal transmission, enabling efficient power conversion for applications like three-phase AC motors.
Implementation Method 1
a transmission circuit electrically insulating the primary control circuit and the secondary power circuit and having a signal transmission function between the primary control circuit and the secondary power circuit
Data Source
AI summary
The power converter A1 includes a semiconductor device B1, and a substrate H on which the semiconductor device B1 is mounted, where the semiconductor device B1 includes a control chip constituting a primary control circuit, a semiconductor chip constituting a secondary power circuit, and a transmission circuit for electrically insulating the primary control circuit and the secondary power circuit and for signal transmission between the primary control circuit and the secondary power circuit. The substrate H has a conductive portion K. The power converter A1 includes a connecting terminal T1 disposed on the substrate H and electrically connected to the conductive portion K. The power converter A1 includes a conductive path D1 that is at least partially formed by the conductive portion K of the substrate H, and that electrically connects the primary control circuit and the connecting terminal T1. Such a configuration contributes to downsizing the power converter A1.