Power Converter Substrate Stacking to Reduce Surge Voltage

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Solution Overview

Problem

Inverter devices face challenges with surge voltage generation due to long current paths between substrates, which can't be addressed by existing connectors suitable for large currents, and spatial limitations restrict substrate arrangement.

Innovation Solution

A power converter design featuring a first substrate with a module and a second substrate with smoothing capacitors connected by a terminal block, allowing a direct current path and reducing impedance, enabling large current flow while maintaining compactness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If substrates are arranged side by side on the same plane, then the device layout is simple, but the current path becomes long causing increased surge voltage

Engineering Contradiction:
Improvesubstrate arrangementVSAvoidsurge voltage
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a planar side-by-side substrate arrangement to a three-dimensional stacked configuration where substrates face each other vertically. This dimensional change shortens the current path from horizontal to vertical, reducing the loop area and consequently minimizing surge voltage generated by L(di/dt) while maintaining layout simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If substrates are separated by long distance, then mounting space is available, but impedance increases causing surge voltage

Engineering Contradiction:
Improvemounting spaceVSAvoidsurge voltage
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

Instead of increasing horizontal separation distance, the patent utilizes vertical stacking to achieve substrate separation. The substrates are positioned at different vertical levels facing each other, which provides adequate mounting space while keeping the current path length short through the vertical connection via terminal block, thereby avoiding impedance-related surge voltage.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If connectors are used to connect substrates, then electrical signals can be transmitted, but large current cannot flow through the connector

Engineering Contradiction:
Improvesignal transmissionVSAvoidcurrent flow capability
Core Design Contradiction:
Ease of operationVSPower

Solution Approach 1:

The patent introduces a terminal block as an intermediary component specifically designed for high-current connections between substrates. The terminal block serves as a robust mediator that can handle large currents unlike standard connectors, while still enabling electrical connection and signal transmission between the substrates through its multiple contact terminals.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces surge voltage by minimizing impedance and allows for efficient current flow between substrates, addressing spatial constraints and enhancing heat dissipation and tolerance to vibrations and gravity loads.

Implementation Method 1

The terminal block includes a current path over which at least one of current flowing from the module to the smoothing capacitor and current flowing from the smoothing capacitor to the module flows

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11486613B2Power converter and air-conditioning apparatus employing the same
Publication Date: 2022.11.01 MITSUBISHI ELECTRIC CORP
  • US11486613B2 patent drawing
  • US11486613B2 patent drawing
  • US11486613B2 patent drawing

AI summary

A power converter includes a first substrate on which a module including a switching element is mounted, a second substrate on which a smoothing capacitor is mounted, and a terminal block connecting the first substrate and the second substrate, with the first and second substrates located to face each other. The terminal block includes a current path over which at least one of current flowing from the module to the smoothing capacitor and current flowing from the smoothing capacitor to the module flows.