Power Converter Board Layout for Vibration-Resistant Signal Terminals

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Solution Overview

Problem

Power conversion devices with semiconductor modules and current sensors connected to control circuit boards are prone to damage from external vibrations due to the connection of control and signal terminals with solder.

Innovation Solution

A power conversion device design that includes a housing, a board with specific through holes and guide holes, and connection portions to securely connect signal terminals, where the number of first through holes per unit area exceeds the number of second through holes, reducing deformation and damage risk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If control terminals and signal terminals are connected to the control circuit board with solder, then electrical connection is achieved, but the terminals may be damaged due to vibrations from external force

Engineering Contradiction:
Improveterminal connection reliabilityVSAvoidvibration damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention divides the connection structure into multiple segments: through holes in the board, guide holes in the guide part, and corresponding insertion portions on terminals. This segmentation allows each component to bear and distribute vibrational stress independently, preventing concentrated damage to solder joints while maintaining electrical connectivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The guide part acts as an intermediary structure between the control circuit board and the terminals. It provides guide holes that align with through holes, creating a mechanical guidance and support system that protects soldered connections from vibration-induced damage while enabling proper terminal insertion and alignment.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the number of first through holes per unit area is increased to suppress board deformation, then structural integrity is improved, but device complexity increases

Engineering Contradiction:
Improveboard structural integrityVSAvoidthrough hole configuration
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention applies different through hole densities to different regions of the board based on local requirements. The first through holes are concentrated in areas requiring enhanced structural support to prevent board deformation, while other areas maintain standard configurations. This localized approach strengthens the board where needed without unnecessarily increasing overall complexity.

Inventive Principle:
Principle #3Local quality

3Reliability

If guide holes are aligned with second through holes to protect signal terminals, then terminal protection is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesignal terminal protectionVSAvoidhole alignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The guide holes are pre-formed in the guide part and aligned with the second through holes in the board during the manufacturing process. This preliminary alignment structure is built in advance, providing built-in guidance that automatically positions signal terminals correctly during assembly, thereby reducing the actual alignment precision required during final assembly operations.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12184190B2Power conversion device
Publication Date: 2024.12.31 DENSO CORP
  • US12184190B2 patent drawing
  • US12184190B2 patent drawing
  • US12184190B2 patent drawing

AI summary

A power conversion device includes a first electrical component, a second electrical component, a housing, a board, and a guide part. The first and second electrical components are accommodated in and fixed to the housing. The board has first through holes into which first signal terminals of the first electrical components are inserted, and second through holes into which second signal terminals of the second electrical components are inserted. The guide part is connected to the board so that guide holes formed therein are aligned with the second through holes. The first signal terminals are connected to the board through a first connection portion, and the second signal terminals are connected to the board through a second connection portion. A number of the first through holes disposed per unit area is greater than a number of second through holes disposed per unit area.