Power Converter Thermal Layout for High-Density Cooling

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Solution Overview

Problem

Existing power conversion systems face challenges in effectively dissipating heat from various heat-generating components, particularly due to the placement of inductor modules and SiC power modules, which leads to increased temperatures and reduced heat dissipation efficiency.

Innovation Solution

A power conversion system design featuring a single heat dissipation fan and heat sink with strategically positioned heat emitters and a heat dissipation fan configuration that separates heat sources to prevent thermal interference, utilizing a case with high thermal conductivity materials and air circulation paths to enhance cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If inductor module and SiC power module are disposed on the same heat sink line, then device complexity is reduced, but heat dissipation efficiency deteriorates due to thermal interference between components

Engineering Contradiction:
Improvestructural complexityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat sinks (first heat sink for SiC power module, second heat sink for inductor module, third heat sink for capacitor), allowing each component to be cooled separately without thermal interference, thus resolving the contradiction between structural simplicity and heat dissipation efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-line heat dissipation arrangement to a three-dimensional spatial distribution of multiple heat sinks positioned at different locations and orientations, enabling effective heat dissipation while maintaining reasonable structural complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If multiple heat sinks are used for different heat emitters, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Each heat sink is designed to serve its specific heat emitter function optimally, with the first heat sink dedicated to SiC power module cooling, the second to inductor module cooling, and the third to capacitor cooling, creating a multi-functional heat dissipation system that improves efficiency while managing complexity through functional specialization

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If heat emitters are spaced apart by predetermined distance, then thermal interference is reduced, but device volume increases

Engineering Contradiction:
Improvethermal interferenceVSAvoiddevice volume
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The patent applies local quality by providing specific spacing distances for different heat emitter pairs based on their thermal characteristics - the first and second heat sinks are spaced to prevent interference between SiC power module and inductor module, while the third heat sink is positioned with appropriate distance from the heat dissipation fan, optimizing thermal isolation without excessive volume increase

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for effective heat dissipation from the SiC power module, inductor module, and capacitor within the same case volume, maintaining high power density and improving temperature management without increasing the size of the heat sink, thus enhancing the overall cooling performance.

Implementation Method 1

a heat sink; a first heat emitter provided on an upper surface of the heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat dissipation fan provided in a direction facing the third heat emitter based on the heat sink

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20240215201A1Power conversion system
Publication Date: 2024.06.27 KOREA ELECTRONICS TECH INST
  • US20240215201A1 patent drawing

AI summary

Provided is a power conversion system including a heat sink, a first heat emitter provided on an upper surface of the heat sink, a second heat emitter electrically connected to the first heat emitter and provided on a lower surface of the heat sink, a third heat emitter provided on one side of the heat sink and spaced apart by a predetermined distance from the heat sink, and a heat dissipation fan provided in a direction facing the third heat emitter based on the heat sink and spaced apart by a predetermined interval from the third heat emitter, wherein, during a normal operation, more heat is emitted by the first heat emitter than by the second heat emitter.