Layered Power Converter Substrates for Heat Dissipation and EMI Shielding

The patent employs a composite substrate structure consisting of a first substrate (for power conversion semiconductor elements), a second substrate (for driving/protecting circuits), and an insulating substrate positioned between them. This composite arrangement enables differentiated thermal management: the first substrate can be designed with high thermal conductivity for efficient heat dissipation from power elements, while the second substrate handles control circuits. The insulating substrate provides electrical isolation while maintaining thermal pathways, thus resolving the contradiction between heat dissipation performance and structural complexity.

The patent segments the substrate system into functionally distinct layers: a first substrate dedicated to mounting power conversion semiconductor elements with optimized thermal pathways, a second substrate for driving and protecting circuits, and an insulating substrate providing electrical isolation. This segmentation allows each layer to be optimized for its specific function - the first substrate can incorporate heat sinks, thermal vias, or high-conductivity materials specifically for heat dissipation, while maintaining the necessary electrical functionality through the insulated connection between substrates.

The insulating substrate acts as an intermediary layer between the first substrate (carrying power conversion elements) and the second substrate (carrying driving and protecting circuits). This intermediary provides electrical isolation that blocks electromagnetic noise coupling between the high-power and low-power circuits, while still allowing mechanical support and controlled signal/power transmission through insulated conductors. Thus, the system maintains functional integration benefits while eliminating electromagnetic interference through the mediating insulating layer.