Power Converter Thermistor Node Reduction

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Solution Overview

Problem

Conventional power converters require multiple nodes on a substrate to detect the voltage of a thermistor element, increasing manufacturing costs.

Innovation Solution

A power converter design that reduces the number of nodes on the substrate by connecting the thermistor element to the ground side node, using a current detection resistor and voltage detection units to generate control signals for semiconductor elements, allowing temperature detection and control without the need for additional nodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the thermistor element is connected to independent nodes ND1 and ND2 on the substrate for voltage detection, then accurate temperature detection is achieved, but the number of substrate nodes increases leading to higher manufacturing costs

Engineering Contradiction:
Improvetemperature detection accuracyVSAvoidnumber of substrate nodes
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the thermistor element's ground connection with the substrate's ground side node. Instead of requiring a dedicated independent node ND2 for the thermistor, the invention connects the thermistor's one end to the existing ground side node that is already part of the substrate's grounding system. This consolidation reduces the total number of nodes required on the substrate while maintaining accurate temperature detection functionality.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If multiple independent nodes are used on the substrate for thermistor voltage detection, then complete voltage measurement is achieved, but manufacturing costs increase

Engineering Contradiction:
Improvevoltage detection accuracyVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The ground side node on the substrate is designed to serve multiple functions simultaneously: it acts as the ground reference for the semiconductor element, provides the grounding path for current detection, and serves as one connection point for the thermistor element. This multi-functional design eliminates the need for dedicated separate nodes for each function, thereby reducing manufacturing complexity and cost while maintaining complete voltage measurement capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design decreases the number of substrate nodes required for thermistor voltage detection, thereby reducing manufacturing costs while maintaining accurate temperature detection and control.

Implementation Method 1

a thermistor element disposed on the substrate for detecting a temperature of the substrate

Methodology Applied
Scientific EffectThermistor effect: Thermistor

Implementation Method 2

a first voltage detection unit configured to detect a first potential at the other end of the current detection resistor and a second potential at the ground side node, and output a first detection signal in accordance with a first potential difference between the first potential and the second potential

Methodology Applied
Scientific EffectVoltage detection: Ohm's Law

Data Source

PatentUS10050031B2Power conventer and semiconductor device
Publication Date: 2018.08.14 SHINDENGEN ELECTRIC MANUFACTURING CO LTD
  • US10050031B2 patent drawing
  • US10050031B2 patent drawing
  • US10050031B2 patent drawing

AI summary

A power converter includes a semiconductor element disposed on a substrate, a thermistor element for detecting the temperature of the substrate, the thermistor element being disposed on the substrate, a current detection resistor having one end connected to a ground side node and another end that is grounded, a first voltage detection unit configured to detect a first potential at the other end of the current detection resistor and a second potential at the ground side node, and output a first detection signal, a control unit configured to control the semiconductor element based on the first detection signal, a temperature detection resistor having one end that is connected to a reference potential and another end that is connected to a detection node, and a temperature detection unit configured to detect a temperature based on a third potential at the detection node, and output a temperature information signal.