Power Converter Wireless Module Control for Easier Assembly

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Solution Overview

Problem

The assembly of electric power conversion apparatuses is cumbersome due to the need for precise alignment of control terminals between semiconductor modules and control circuit boards, and positional deviations during assembly can lead to reliability issues and increased complexity, especially with multiple modules.

Innovation Solution

Incorporating a wireless communication unit that allows for wireless communication between semiconductor modules and control circuit boards, eliminating the need for wired connections and ensuring clear paths between communication devices to prevent signal interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wired connections are used between semiconductor modules and control circuit board, then electrical signals can be transmitted reliably, but assembly becomes cumbersome and complex due to precise alignment requirements

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical wired connection system with a wireless communication system. Communication devices are provided on both the control circuit board and semiconductor modules, enabling signal transmission without physical connectors. This eliminates the need for precise alignment of control terminals during assembly while maintaining reliable signal transmission through electromagnetic fields.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If wired connections are used between semiconductor modules and control circuit board, then electrical signals can be transmitted, but positional deviations during assembly lead to reliability issues

Engineering Contradiction:
Improveconnection reliabilityVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent eliminates the mechanical connection system that requires precise alignment by implementing wireless communication. The communication devices transmit signals through electromagnetic fields without requiring physical contact or precise positioning, thereby removing the dependency on manufacturing precision for alignment while ensuring connection reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Power

If multiple semiconductor modules are used, then power conversion capacity increases, but assembly complexity and risk of positional deviations increase

Engineering Contradiction:
Improvepower conversion capacityVSAvoidassembly complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent applies wireless communication to each semiconductor module independently, allowing multiple modules to be installed without increasing assembly complexity. Each module communicates with the control circuit board through its own communication device, eliminating the need for complex wiring and alignment procedures that would otherwise scale with the number of modules.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS12170492B2Electric power conversion apparatus
Publication Date: 2024.12.17 DENSO CORP
  • US12170492B2 patent drawing
  • US12170492B2 patent drawing
  • US12170492B2 patent drawing

AI summary

An electric power conversion apparatus includes a semiconductor module, a control circuit board and a wireless communication unit. The semiconductor module has at least one semiconductor element built therein. The control circuit board is configured to control the semiconductor module. The wireless communication unit is configured to wirelessly communicate electrical signals between the semiconductor module and the control circuit board. The wireless communication unit includes a first communication device provided on the control circuit board so as to face the semiconductor module, and a second communication device provided on the semiconductor module so as to face the control circuit board. Moreover, there are no obstacles on a straight path between the first and second communication devices.