Power Cut-Off Switch Placement for Voltage Drop and Routability
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Solution Overview
Problem
The installation of multiple power cut-off switches in the power cut-off region of semiconductor integrated circuit devices reduces the number of wiring channels, worsening routability and increasing voltage drop due to resistance in the power supply wiring.
Innovation Solution
Locating the power cut-off switch outside the power cut-off region and using a substrate-side feed line to transmit power-supply voltage back into the semiconductor chip, allowing for a larger cross-sectional area of wiring on the substrate to reduce resistance and voltage drop without reducing the degree of freedom in routing signal wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If multiple power cut-off switches are installed in the power cut-off region, then voltage drop is suppressed, but the number of wiring channels is reduced and routability worsens
Solution Approach 1:
The power supply system is segmented into two parts: power cut-off switches are placed in the substrate (package side) while power supply wiring is provided in the semiconductor chip. This segmentation allows voltage drop suppression through multiple switches without consuming wiring channels in the power cut-off region, resolving the contradiction between voltage stability and routability.
Solution Approach 2:
The invention moves the power cut-off switches from the semiconductor chip plane to the substrate plane (another dimension), allowing power supply wiring to be provided in the chip without occupying signal wiring channels. This dimensional transition resolves the conflict between voltage drop suppression and routing flexibility.
2Reliability
If power cut-off switches are installed in the power cut-off region, then power supply control is improved, but wiring channel availability is reduced
Solution Approach 1:
The device is segmented into substrate and semiconductor chip components, with power cut-off switches located in the substrate and power supply wiring in the chip. This segmentation maintains reliable power control while preserving wiring channel availability in the power cut-off region for signal routing.
Solution Approach 2:
The substrate acts as an intermediary layer that hosts the power cut-off switches, mediating between the external power supply and the semiconductor chip. This intermediary arrangement provides power control functionality without complicating the internal wiring of the power cut-off region.
Data Source
AI summary
Disclosed here is a semiconductor integrated circuit device configured to suppress a voltage drop over the route for transmitting voltages from a power cut-off switch to a power cut-off region without lowering the degree of freedom in routing signal wires in that region. The semiconductor integrated circuit device includes a semiconductor chip in which the power cut-off switch and power cut-off region are provided. A reduction in the number of wiring channels in the power-cut off region is avoided by locating the power cut-off switch outside the power cut-off region. Over the substrate, a substrate-side feed line is formed to transmit a power-supply voltage from the semiconductor chip to outside thereof via the power cut-off switch, before introducing the voltage again into the chip to feed the power cut-off region, thus suppressing the voltage drop between the power cut-off switch and the power cut-off region.