Power Cycling Test Structure Thermal Profiling
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Solution Overview
Problem
There is currently no reliable method to assess thermally-induced mechanical stress in electronic components and interconnect mechanisms, such as microprocessors, printed circuit boards, and solder bumps, during power cycling.
Innovation Solution
A power cycling test system that includes a heat source interconnected with a package via a first level interconnect mechanism and a printed circuit board via a second level interconnect mechanism, where thermal and voltage feedback are monitored to determine a thermal profile, allowing for adjustments to the provided current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power cycling is performed to reinitialize device configuration or recover from unresponsive state, then device operational reliability is improved, but thermally-induced mechanical stress on electronic components and interconnect mechanisms increases
Solution Approach 1:
The system performs preliminary thermal profiling and assessment before actual power cycling operations by providing current to a test structure that replicates the thermal and mechanical conditions. This allows prediction and prevention of potential failures before they occur in the actual device during power cycling.
Solution Approach 2:
A separate power cycling test structure serves as an intermediary between the actual electronic device and the testing apparatus. This test structure includes replicated interconnect mechanisms and components that experience the thermal stress, allowing indirect assessment without damaging the actual device being tested.
2Ease of operation
If traditional power cycling testing is performed without thermal profiling, then testing simplicity is maintained, but assessment reliability of thermally-induced mechanical stress is insufficient
Solution Approach 1:
The system incorporates thermal feedback mechanisms by monitoring temperature changes in the test structure during power cycling. This feedback is used to dynamically adjust the applied current and build an accurate thermal profile, enabling reliable stress assessment while maintaining automated operation that does not significantly increase operational complexity.
Solution Approach 2:
The system replaces complex mechanical stress measurement techniques with electrical measurements. By monitoring voltage changes across the test structure during thermal cycling, the system indirectly measures mechanical stress effects through electrical property changes, simplifying the measurement process while improving reliability.
3Productivity
If current is increased to accelerate power cycling testing, then testing productivity is improved, but thermal mechanical stress on components and interconnects increases
Solution Approach 1:
The system dynamically adjusts the current applied to the test structure based on real-time thermal profile data. Rather than using fixed high current to accelerate testing, the current is modulated to maintain optimal testing speed while keeping thermal stress within safe limits, as determined by the thermal profile and material characteristics.
Solution Approach 2:
The system changes multiple parameters simultaneously - adjusting current magnitude, duration, and timing based on the thermal profile. This allows optimization of testing productivity by applying higher currents only when thermal conditions permit, and using lower currents when approaching stress limits, thereby accelerating testing without excessive stress accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides a reliable assessment of thermally-induced mechanical stress, enabling the evaluation of interconnect reliability and detection of failures, thereby improving the reliability of electronic devices under power cycling conditions.
Implementation Method 1
providing, via the power supply, a current to the power cycling test structure... a heat source to provide thermal energy to the power cycling test structure
Implementation Method 2
monitoring, by the computing device, thermal feedback associated with the heat source... determining, by the computing device, a thermal profile of the power cycling test structure based on the thermal feedback
Implementation Method 3
monitoring, by the computing device, voltage feedback associated with the power cycling test structure... based on the provided current
Data Source
AI summary
A device instructs a power supply to provide a current to a power cycling test structure that includes a heat source interconnected with a package, via a first level interconnect mechanism, and a printed circuit board (PCB) interconnected with the package, via a second level interconnect mechanism. The device also monitors thermal feedback associated with the heat source, and monitors, based on the provided current, voltage feedback associated with the power cycling test structure. The device further determines a thermal profile of the power cycling test structure based on the thermal feedback and the voltage feedback.