Power Delivery Device Stabilizing Voltage via Bump Array and Capacitors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As circuit devices operate at higher speeds, high frequency signals significantly impact the power supply, leading to instability in the supply voltage, which affects the circuit's performance.
Innovation Solution
A power delivery device and method that includes a printed circuit board (PCB) with a bump array, conductive balls, and capacitors/ferrite beads to transmit and decouple reference voltages, reducing high frequency signals and stabilizing the supply voltage by using parallel plate capacitors and ferrite beads to suppress noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the circuit device operates at higher speeds, then the processing capability is improved, but the high frequency signal impact on power supply increases
Solution Approach 1:
The power delivery device is segmented into multiple functional modules: PCB with reference voltage input, package device with bump array for voltage transmission, and chip connecting device for output. This segmentation allows each module to be optimized for its specific function, particularly in filtering and stabilizing power at different stages of delivery.
Solution Approach 2:
Capacitor devices are introduced as intermediary elements between the reference voltage input and the power output stages. These capacitors act as mediators that filter high frequency signals and stabilize voltage, preventing direct transmission of noise from the power supply to the circuit device.
2Device complexity
If conventional power delivery methods are used, then the implementation is simple, but the supply voltage becomes unstable due to high frequency signals
Solution Approach 1:
Capacitor devices are introduced as intermediary elements between the reference voltage input and the power output stages. These capacitors act as mediators that filter high frequency signals and stabilize voltage, preventing direct transmission of noise from the power supply to the circuit device.
Solution Approach 2:
The patent modifies the electrical parameters of the power delivery path by introducing capacitor devices with specific capacitance values and ferrite beads with specific impedance characteristics. These parameter changes enable effective filtering of high frequency signals while maintaining DC power transmission efficiency.
3Power
If high frequency signals are present in the power supply, then the power delivery is efficient, but the signal noise ratio deteriorates
Solution Approach 1:
Capacitor devices are introduced as intermediary elements between the reference voltage input and the power output stages. These capacitors act as mediators that filter high frequency signals and stabilize voltage, preventing direct transmission of noise from the power supply to the circuit device.
Solution Approach 2:
The capacitor devices and ferrite beads extract and remove high frequency noise components from the power supply signal while allowing the DC power component to pass through. This separation enables efficient power delivery while eliminating the harmful high frequency signals that degrade signal quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more stable supply voltage to circuit devices, reducing the influence of high frequency signals and enhancing the signal noise ratio (SNR) in the power delivery system.
Implementation Method 1
a capacitor device, and the capacitor device is coupled between the first via and the second via
Implementation Method 2
The first ferrite bead is coupled to the first conductive plate, and the first conductive plate receives the first reference voltage through the first ferrite bead
Data Source
AI summary
A power delivery device includes a printed circuit board (PCB), a package device, and a chip connecting device. The PCB is configured to receive a first reference voltage and a second reference voltage. The package device is coupled to the PCB, and includes a bump array. The chip connecting device is coupled to the bump array of the package device, and configured to output a first supply voltage and a second supply voltage. The bump array includes first bumps and second bumps. The first bumps are configured to transmit the first reference voltage. The second bumps are configured to transmit the second reference voltage. The first bumps and the second bumps are disposed in parallel.