3-D Power Delivery Controller for Heterogeneous Stacked Apparatus
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Solution Overview
Problem
In heterogeneous three-dimensional stacked apparatuses, voltage variations and IR drops between layers lead to inefficiencies in power delivery, particularly due to tungsten-based through-silicon-via technologies and board-level controlled collapse chip connection pitch restrictions, which limit energy efficiency and integration of diverse technologies.
Innovation Solution
A 3-D power delivery controller with a voltage control table and control logic that scans for changes, calculates voltage regulation commands, and distributes them to voltage converters to manage power delivery on a tile basis, optimizing supply current levels and minimizing voltage variations and IR drops by selectively regulating voltage across layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If tungsten-based through-silicon-via (TSV) technologies are used for power delivery between layers, then vertical interconnect capability is improved, but IR drops increase due to electrical conductivity characteristics and aspect ratio limitations
Solution Approach 1:
The power delivery system is segmented into multiple independent power delivery networks, each serving specific layers or regions. This allows optimization of each segment's TSV configuration and reduces the overall IR drop by distributing current paths across multiple smaller networks rather than relying on a single high-current path through long TSVs.
Solution Approach 2:
Different TSV configurations and materials are applied to different regions of the apparatus based on local power density requirements. High-current regions use TSVs with larger cross-sections or alternative materials, while low-current regions use standard TSVs, optimizing the balance between vertical interconnect capability and energy loss.
2Manufacturing precision
If board-level controlled collapse chip connection (C4) pitch restrictions are applied, then manufacturing precision is improved, but power delivery efficiency to stacked layers deteriorates
Solution Approach 1:
The power delivery architecture transitions from a two-dimensional planar distribution to a three-dimensional stacked configuration with multiple power delivery networks operating at different vertical levels. This dimensional transition allows efficient power delivery despite restricted C4 pitch by utilizing vertical space for current distribution.
Solution Approach 2:
Intermediate voltage conversion stages are introduced between the board-level power input and the final load layers. These intermediary voltage converters optimize the voltage levels at each stacking level, reducing current requirements and thereby improving power delivery efficiency without requiring tighter C4 pitch.
3Adaptability or versatility
If voltage conversion between layers is performed, then voltage requirements for different layers are met, but power loss during conversion reduces overall energy efficiency
Solution Approach 1:
Voltage conversion is performed in advance at optimal points in the power delivery path, converting board-level voltage to intermediate voltages before distribution to specific layer groups. This preliminary conversion reduces the total conversion requirement across the stack and minimizes cumulative power losses compared to multiple small conversion steps.
Solution Approach 2:
The power delivery controller continuously monitors voltage and current conditions across different layers and dynamically adjusts voltage conversion parameters to optimize efficiency. This feedback mechanism ensures voltage requirements are met while minimizing power loss during conversion by operating converters in their most efficient ranges.
4Adaptability or versatility
If multiple layers with different voltage requirements are integrated, then technological diversity and functionality are improved, but power distribution complexity increases
Solution Approach 1:
The heterogeneous multi-layer apparatus is divided into multiple independent power delivery networks, each responsible for specific layers with similar voltage requirements. This segmentation simplifies power distribution control by allowing each network to be managed independently, reducing the overall system complexity despite the diversity of voltage requirements.
Solution Approach 2:
The power delivery controller is designed with universal functionality to manage multiple power delivery networks simultaneously, handling different voltage requirements, current demands, and conversion needs through a single integrated control architecture. This universal controller reduces complexity by consolidating control functions rather than requiring separate controllers for each layer or network.
Data Source
AI summary
A heterogeneous three-dimensional (3-D) stacked apparatus is provided that includes multiple layers arranged in a stacked configuration with a lower layer configured to receive a board-level voltage and one or more upper layers stacked above the lower layer. The heterogeneous 3-D stacked apparatus also includes multiple tiles per layer, where each tile is designed to receive a separately regulated voltage. The heterogeneous 3-D stacked apparatus additionally includes at least one layer in the one or more upper layers with voltage converters providing the separately regulated voltage converted from the board-level voltage.