Power Electronic Device Potting With Closed Contact Sleeves
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Solution Overview
Problem
Existing methods for producing power electronic devices face issues with potting compound penetration into metallic sleeves, rendering them unusable for plug contacts, and require precise tolerances that complicate the production process.
Innovation Solution
The method involves using metallic sleeves bonded at a right angle to the substrate, encapsulating the power semiconductor and sleeves with a potting compound while ensuring the sleeve ends facing away from the substrate are closed to prevent compound penetration, and then machining these ends to accommodate plug contacts after encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate thickness and distance from openings to substrate are kept precise to prevent potting compound penetration, then the reliability of connection is improved, but the manufacturing complexity and tolerance requirements increase
Solution Approach 1:
The sleeve ends are closed before the potting compound is applied, preventing compound penetration into the sleeves. This preliminary protective action eliminates the need for precise thickness control of the substrate and precise positioning of openings, thereby reducing manufacturing complexity and tolerance requirements while maintaining connection reliability
Solution Approach 2:
The closed sleeve ends act as an intermediary barrier between the potting compound and the interior of the sleeves. This mediator prevents the harmful interaction (compound penetration) without requiring precise dimensional control of other components, thus simplifying the production process while ensuring reliable connections
2Ease of operation
If the sleeves are left open to accommodate plug contacts, then the ease of operation is improved, but the risk of potting compound penetration increases
Solution Approach 1:
The sleeves are closed before the potting compound is applied, preventing compound penetration. After encapsulation, the closed ends are machined to create openings that accommodate plug contacts. This sequence ensures both protection during manufacturing and ease of operation in the final product
Solution Approach 2:
The sleeve structure is segmented into two functional parts: the closed end that prevents compound penetration during manufacturing, and the machined opening that accommodates plug contacts for ease of operation. This segmentation allows both requirements to be satisfied simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents sleeve contamination, simplifies the production process, reduces material waste, and allows for efficient electrical contacting of control and signal contacts with small cross-sections, facilitating compact and cost-effective power electronic device manufacturing.
Implementation Method 1
The bonding can be achieved, in particular, by sintering, soldering, welding, in particular ultrasonic welding and/or laser welding, and/or adhesive bonding.
Implementation Method 2
The bonding can be achieved, in particular, by sintering, soldering, welding, in particular ultrasonic welding and/or laser welding, and/or adhesive bonding.
Implementation Method 3
The bonding can be achieved, in particular, by sintering, soldering, welding, in particular ultrasonic welding and/or laser welding, and/or adhesive bonding.
Implementation Method 4
The bonding can be achieved, in particular, by sintering, soldering, welding, in particular ultrasonic welding and/or laser welding, and/or adhesive bonding.
Implementation Method 5
The bonding can be achieved, in particular, by sintering, soldering, welding, in particular ultrasonic welding and/or laser welding, and/or adhesive bonding.
Data Source
Figure 1
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AI summary
The invention relates to a method for producing a power electronic device (10), wherein a substrate, in particular a printed circuit board, is populated with a power semiconductor (12) and a metallic region (14) of the substrate is electrically contacted by means of a metallic sleeve (18) for receiving a plug contact (20). The power semiconductor (12) and the sleeve (18) are encapsulated with a potting compound. The end (28) of the sleeve (18) facing away from the substrate is designed to be closed at least to the extent that penetration of the potting compound is prevented.