Power Device Driver Board Cooling Manifold Integration
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Solution Overview
Problem
Conventional heat sinks and cooling structures in power electronics devices are inadequate for managing high operating temperatures, as they introduce substantial thermal resistance and require additional bonding layers, making it challenging to effectively cool power semiconductor devices in high-power applications.
Innovation Solution
A driver board assembly with a bonded cooling manifold structure, featuring a first substrate with jet impingement assemblies and a multilayer cooling manifold that eliminates the need for thermal resistance layers by directly bonding the cooling manifold to the substrate, allowing coolant to efficiently remove heat from power devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks and cooling structures are used, then heat removal capability is provided, but substantial thermal resistance is introduced and operating temperature cannot be effectively lowered
Solution Approach 1:
The patent merges the substrate and cooling manifold into a single integrated structure where the manifold is directly bonded to the substrate, eliminating separate bonding layers and thermal interface materials. This integration removes additional thermal resistance layers while maintaining effective heat removal capability, directly resolving the contradiction between lowering operating temperature and reducing thermal resistance.
Solution Approach 2:
The patent extracts and eliminates the unnecessary bonding layers and thermal interface materials from the conventional cooling structure. By removing these intermediate layers that introduce thermal resistance, the cooling manifold makes direct contact with the substrate, thereby reducing thermal resistance while maintaining the heat removal function.
2Temperature
If conventional cooling structures with additional bonding layers are used, then heat sink functionality is provided, but device complexity and manufacturing complexity increase
Solution Approach 1:
The substrate and cooling manifold are merged into an integrated assembly with direct bonding, eliminating multiple separate components and bonding layers. This reduces device complexity while maintaining cooling effectiveness, as the manifold is directly attached to the substrate without intermediate layers.
Solution Approach 2:
The integrated manifold structure serves multiple functions simultaneously: it provides cooling channels for heat removal, acts as a structural component, and eliminates the need for separate bonding layers. This multi-functionality reduces the overall number of components and simplifies the device structure.
3Power
If power electronics devices operate at increased power levels, then higher power density is achieved, but heat generation increases and conventional cooling becomes inadequate
Solution Approach 1:
The integrated cooling manifold directly bonded to the substrate provides enhanced thermal pathways that can handle higher heat loads from increased power levels. The direct bonding eliminates thermal resistance barriers, enabling effective heat removal even when power density and heat generation are significantly increased.
Solution Approach 2:
The patent changes the thermal parameters of the system by eliminating bonding layers and using direct bonding, which fundamentally alters the thermal conductivity and heat transfer characteristics. This enables the system to dissipate the increased heat generated by higher power operation effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables lower operating temperatures and higher power density in power electronics, effectively preventing overheating and damage by integrating embedded cooling fluid channels, allowing for operation at temperatures exceeding 200°C without the need for additional thermal resistance layers.
Implementation Method 1
Cooling fluid may be used to receive heat generated by the power semiconductor device by convective thermal transfer
Implementation Method 2
Another way to remove heat from a power semiconductor device is to couple the power semiconductor device to a finned heat sink made of a thermally conductive material
Data Source
AI summary
A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.