Packaged Power Device With Internal Liquid Cooling Channels
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Solution Overview
Problem
High-power electronic devices face challenges in heat dissipation, leading to increased size and weight, which is undesirable in applications like automotive and portable electronics where space and weight reduction are crucial.
Innovation Solution
A semiconductor package design featuring dual dissipative regions connected by screws, with internal chambers and channels for a cooling liquid to circulate, enhancing heat transfer through capillary action and natural convection, while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks or cooling boxes are used to increase dissipative surface area, then heat dissipation capacity is improved, but device volume and weight increase significantly
Solution Approach 1:
The patent embeds the cooling liquid channels and chambers directly within the package structure itself, nesting the thermal management system inside the device rather than adding external heat sinks. The channels are formed within the package body, creating a compact integrated solution that provides effective heat dissipation without increasing overall device volume.
Solution Approach 2:
The patent employs a liquid cooling system where cooling liquid circulates through channels and chambers within the package to transfer heat away from the semiconductor die. This hydraulic approach enables efficient heat removal in a compact form factor, avoiding the need for bulky solid heat sinks while maintaining high heat dissipation capacity.
2Temperature
If traditional heat sinks or cooling boxes are used to increase dissipative surface area, then heat dissipation capacity is improved, but device weight increases
Solution Approach 1:
The cooling system is integrated within the package structure, eliminating the need for separate external heat sinks that would add weight. The channels and chambers are formed as part of the package body, creating a lightweight compact solution that maintains effective heat dissipation capacity.
Solution Approach 2:
The liquid cooling system replaces heavy solid heat sink structures with a lighter fluid-based thermal management approach. The cooling liquid circulating through the integrated channels provides efficient heat removal with significantly reduced weight compared to traditional heat sink solutions.
3Temperature
If cooling liquid channels are added to the package structure, then heat transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The package structure is divided into functional regions including channels and chambers for cooling liquid flow, with dissipative regions separated from non-dissipative regions. This segmentation allows for optimized thermal management while maintaining manufacturability through modular design and standardized manufacturing processes.
Solution Approach 2:
The package structure serves multiple functions simultaneously: it provides mechanical support for the semiconductor die, creates electrical connections, and incorporates thermal management channels. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process while maintaining effective heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal dissipation efficiency, reduces thermal and mechanical stresses, and increases the Mean Time To Failure (MTTF) by lowering operating temperatures and parasitic inductances, thus enhancing the overall efficiency and reducing electromagnetic interference.
Implementation Method 1
enhancing heat transfer through capillary action and natural convection
Implementation Method 2
enhancing heat transfer through capillary action and natural convection
Implementation Method 3
enhancing heat transfer through capillary action and natural convection
Data Source
AI summary
A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.