Power Device Package Structure with Direct Bonding
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Solution Overview
Problem
Current power device package structures face issues with excessive parasitic inductance and thermal resistance, particularly in vehicle generators, due to interconnects and poor heat dissipation of insulating substrates, affecting power module response and efficiency.
Innovation Solution
A power device package structure featuring directly connected power devices on a high thermal conductivity substrate with an insulation film and a base of high heat capacity, reducing parasitic inductance and thermal resistance through flip chip bonding and efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power devices are connected using an interconnect, then electrical connection between devices is achieved, but parasitic inductance increases excessively
Solution Approach 1:
The patent removes the interconnect from the system by implementing direct bonding between power devices and the substrate. The substrate itself serves as the electrical connection path, eliminating the need for separate interconnect structures and thereby removing the source of parasitic inductance.
Solution Approach 2:
The patent merges the electrical connection function with the substrate structure. Instead of using a separate interconnect layer, the substrate is designed to provide both mechanical support and electrical connectivity, integrating multiple functions into a single component.
2Reliability
If an insulating substrate is used to isolate power device and control circuit, then electrical insulation is achieved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent divides the substrate into functionally distinct regions: a first substrate region with high thermal conductivity for mounting power devices and providing heat dissipation, and a second substrate region with insulating properties for mounting control circuits. This segmentation allows each region to optimize its specific function without compromising the other.
Solution Approach 2:
The patent applies different material properties to different locations of the substrate. The first substrate region uses materials with high thermal conductivity (such as copper or aluminum) specifically where heat generation occurs, while the second region uses insulating materials appropriate for control circuitry, thereby optimizing both heat dissipation and electrical insulation locally.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes parasitic inductance and thermal resistance, enhancing power module response and heat dissipation, making it suitable for high-power applications like vehicle generators and rectifiers.
Implementation Method 1
the thermal resistance of the power module is indirectly increased
Implementation Method 2
an insulating substrate is currently used as a carrier plate of the control circuit to isolate the power device and the control circuit
Implementation Method 3
a base having high heat capacity is disposed below the substrate
Implementation Method 4
the heat dissipation of the insulating substrate is poor
Data Source
AI summary
A package structure of a power device includes a substrate having a first circuit, a first power device, a second power device, an insulation film having a second circuit, at least one electronic component, and a package. The first power device, the second power device, and the insulation film are disposed on the substrate. The first power device and the second power device are directly electrically connected to each other via the first circuit of the substrate. The electronic component is disposed on the insulation film. The package encapsulates the substrate, the first power device, the second power device, and the electronic component.