Power Device Package Structure with Integrated Capacitor
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Solution Overview
Problem
Conventional power device package structures lack integrated capacitors, leading to longer metal wires and increased parasite inductance effects, resulting in higher power consumption and inefficiency.
Innovation Solution
Incorporating a dielectric material layer and an upper metal layer on a metal base plate within the package structure to form a capacitor, reducing wiring length and parasite inductance, and optionally including resistors to minimize energy loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the capacitor is arranged outside the package structure, then the package structure is simpler to manufacture, but the metal wire length increases leading to higher parasite inductance and power consumption
Solution Approach 1:
The patent merges the capacitor with the package structure by forming the capacitor between the metal base plate and an upper metal layer within the package body. This integration eliminates the need for separate external capacitor components and their connecting wires, thereby reducing parasite inductance and power consumption while maintaining manufacturing feasibility through a unified structure
2Reliability
If the capacitor is integrated within the package structure, then the metal wire length is reduced lowering parasite inductance, but the package structure becomes more complex
Solution Approach 1:
The metal base plate serves dual functions: as the structural foundation of the package and as one electrode of the capacitor. The upper metal layer serves as both a protective/structural element and the other capacitor electrode. This multi-functionality reduces the need for additional components while achieving low parasite inductance through integrated capacitor formation
3Ease of manufacture
If longer metal wires are used to connect the capacitor externally, then the package structure is easier to manufacture, but the parasite inductance effects increase
Solution Approach 1:
By combining the capacitor formation process with the existing package structure fabrication, the patent eliminates long external connecting wires. The capacitor is formed in-situ between the metal base plate and upper metal layer during the same manufacturing process, thereby reducing parasite inductance without significantly complicating the manufacturing workflow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces parasite inductance and energy loss, enhancing power transmission efficiency and achieving energy savings by integrating capacitors and resistors directly within the package structure.
Implementation Method 1
The upper metal layer, the dielectric material layer and the metal base plate form a capacitor
Data Source
AI summary
The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.