Power Device Transfer-Curve Matching for Parallel Module Binning
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Solution Overview
Problem
Current die binning and matching methods for multi-chip devices, such as power modules, are inadequate as they only capture static or dynamic loss mechanisms individually, lacking a clear correlation between on-state resistance and threshold voltage, leading to poor matching results.
Innovation Solution
A method and system that utilize device transfer curves and transfer functions to determine binning and matching criteria, capturing both static and dynamic loss mechanisms by measuring currents and voltages over time, allowing for accurate characterization and matching of power devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional die binning methods are used, then manufacturing simplicity is maintained, but matching accuracy between parallel devices is poor
Solution Approach 1:
The patent replaces traditional mechanical/categorical binning methods with a data-driven transfer curve analysis system. Instead of physically sorting devices into bins based on simple parameters, the system uses computational analysis of transfer characteristics to automatically determine matching groups, achieving higher precision through electronic measurement and algorithmic processing.
2Measurement precision
If comprehensive transfer curve measurements are performed, then both static and dynamic parameters are captured, but measurement complexity increases
Solution Approach 1:
The patent segments the transfer curve measurement into discrete, manageable voltage points (e.g., 0V, 2V, 4V, 6V, 8V, 10V gate-source voltage points). By dividing the continuous measurement range into specific segments, the system achieves comprehensive characterization while maintaining measurement organization and reducing computational complexity through structured data collection.
Data Source
AI summary
A device binning and/or matching process includes measuring with a testing device currents and/or voltages of a device with respect to time, determining with the testing device binning and/or matching criteria for the device based on transfer data generated from the device currents and/or the voltages measured with respect to time, and outputting with the testing device the binning and/or matching criteria for the device. A system and power module are also disclosed.