Power Die Conductive Layer Layout for Double-Sided Heat Dissipation
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Solution Overview
Problem
As power output from power modules increases, heat dissipation becomes a significant challenge.
Innovation Solution
The electronic device incorporates double-sided heat dissipation structures and conductive layers with spacers and bond wirings to efficiently dissipate heat, utilizing materials like copper, gold, silver, aluminum, or tantalum for high thermal conductivity, and includes double-sided heat dissipation structures and thermal adhesive layers to manage heat dissipation through opposite sides of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power output from power modules is increased, then power capability is improved, but heat dissipation becomes more challenging
Solution Approach 1:
The conductive layer is divided into multiple separate parts (first conductive layer with first and second parts, second conductive layer with first and second parts) that are spatially distributed on opposite sides of the power die. This segmentation allows heat to be dissipated through multiple independent pathways simultaneously, effectively managing the thermal load generated by high power output.
Solution Approach 2:
The patent transitions from single-sided heat dissipation to double-sided heat dissipation by placing conductive layers on both the first and second surfaces of the power die. This dimensional change enables heat to be extracted from both sides of the power module, significantly improving thermal management capability while maintaining high power output.
2Temperature
If conductive layers are separated into multiple parts, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The separated conductive layer parts serve multiple functions: they provide electrical connection to different terminals of the power die, enable double-sided heat dissipation, and maintain structural support. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity despite the segmented structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation, preventing short circuits and ensuring efficient operation of power transistors by maintaining thermal integrity and reducing the need for lead frames.
Implementation Method 1
The electronic device incorporates double-sided heat dissipation structures and conductive layers with spacers and bond wirings to efficiently dissipate heat, utilizing materials like copper, gold, silver, aluminum, or tantalum for high thermal conductivity
Data Source
AI summary
An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes a first conductive layer and a first power die. The first conductive layer including a first part and a second part separated from the first part. The first power die is disposed above the first conductive layer and has a first surface. The first power die includes a first terminal exposed from the first surface and a second terminal exposed from the first surface. The first part is electrically connected to the first terminal and the second part is electrically connected to the second terminal.