Power Diode Adhesive Bubble Removal via Pressure Cycling
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Solution Overview
Problem
The manufacturing process of power diodes often results in air bubbles within the adhesive material, which adversely affect the quality of the diodes by reducing their reliability and performance.
Innovation Solution
A method involving a processing chamber where pressure is alternately adjusted to specific predetermined pressures, first between a vacuum environment and normal pressure, and maintained for a duration, repeated multiple times to alter the surface tension and effectively remove air bubbles from the adhesive material surrounding the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive material is applied to surround the semiconductor chip, then the chip is protected during manufacturing, but air bubbles are generated in the adhesive material which reduces power diode quality
Solution Approach 1:
The patent applies preliminary action by performing pressure cycling treatment on the semi-finished product before final assembly completion. The pressure cycling is conducted in advance to remove air bubbles from the adhesive material, preventing quality issues before they affect the final product performance
Solution Approach 2:
The patent utilizes parameter changes by varying the pressure conditions in the processing chamber during the treatment process. By changing pressure between different stages (vacuum to atmospheric pressure cycles), the adhesive material's air bubbles are effectively removed while maintaining the protective function
2Manufacturing precision
If pressure cycling treatment is applied to remove air bubbles, then adhesive material quality is improved, but additional processing time is required
Solution Approach 1:
The patent implements periodic action through pressure cycling treatment, where the pressure is repeatedly adjusted between vacuum and atmospheric pressure states. This periodic pressure variation efficiently removes air bubbles through multiple cycles, achieving high manufacturing precision while managing processing time through optimized cycle repetition
Solution Approach 2:
The patent applies skipping by rapidly transitioning between pressure states during the cycling process. The quick pressure changes reduce the time spent in each transition phase, allowing the treatment to be completed more efficiently while still achieving thorough air bubble removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the presence of air bubbles in the adhesive material, thereby enhancing the quality and reliability of the power diodes, particularly those used in vehicle electronic products.
Implementation Method 1
the disclosure can change a surface tension of the air bubbles in the adhesive material of the semi-finished of the power diode by converting between the first predetermined pressure and the second predetermined pressure in the processing chamber to achieve the effect of eliminating the air bubbles
Data Source
AI summary
A method for manufacturing a power diode including the following steps is provided. (a) A semi-finished product of the power diode is provided. The semi-finished product of the power diode includes a first electrode, a second electrode, a semiconductor chip, and an adhesive material. The semiconductor chip is located between the first electrode and the second electrode. The adhesive material is located on the first electrode and surrounds the semiconductor chip. (b) The semi-finished product of the power diode is placed into a processing chamber. (c) Pressure in the processing chamber is adjusted to a first predetermined pressure and the first predetermined pressure is maintained for a predetermined time. (d) Pressure in the processing chamber is adjusted to a second predetermined pressure. Step (c) to Step (d) are performed at least twice to form the power diode. (e) The power diode is removed from the processing chamber.