Power Distribution Assembly Cooling Arrangement
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Solution Overview
Problem
High-density compute environments, such as data centers, face challenges in cooling heat-sensitive components within power distribution assemblies, leading to reduced reliability due to increased temperatures, which existing cooling methods are energy-intensive and costly, and immersion cooling requires significant infrastructure modifications.
Innovation Solution
A power distribution assembly with a cooling arrangement featuring a non-electrically conductive fluid within a hermetically sealed casing, which contacts heat-sensitive components to transfer heat via convection, using thermally conductive walls and a heat sink to optimize cooling, while maintaining electrical connectivity and reducing the volume of the cooling effect for targeted thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling methods are used for power distribution assemblies, then the cooling coverage is comprehensive, but the energy consumption is high and the cost is expensive
Solution Approach 1:
The patent implements localized cooling by providing a cooling arrangement specifically for the controller within the power distribution assembly. The cooling arrangement includes a cooling element that is positioned adjacent to the controller to remove heat locally, rather than cooling the entire power distribution assembly or data center environment. This targeted approach reduces energy consumption while maintaining reliability of heat-sensitive components.
2Reliability
If immersion cooling is implemented, then cooling efficiency is improved, but infrastructure modification requirements and complexity increase significantly
Solution Approach 1:
The patent extracts the cooling function from the overall power distribution assembly by providing a separate, self-contained cooling arrangement. The cooling element is positioned within the power distribution assembly but operates independently, allowing efficient cooling of the controller without requiring immersion cooling of the entire system or significant infrastructure modifications to the data center.
3Reliability
If cooling arrangements are added to power distribution assemblies, then heat-sensitive components are protected, but the device complexity and space requirements increase
Solution Approach 1:
The patent merges the cooling arrangement with the power distribution assembly by positioning the cooling element within the same housing or enclosure as the controller. The cooling arrangement is integrated into the existing power distribution assembly structure, protecting heat-sensitive components without requiring separate standalone cooling systems or increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient and reliable cooling of heat-sensitive components, reducing the operational temperature and maintaining system reliability without the need for extensive infrastructure changes, thus addressing the constraints posed by rising temperatures in high-density compute environments.
Implementation Method 1
a non-electrically conductive fluid, at least a portion of the coolant being configured to come into contact with at least part of the controller for transferring heat away from the at least one controller and/or at least one component
Implementation Method 2
using thermally conductive walls and a heat sink to optimize cooling
Data Source
AI summary
A power distribution assembly is disclosed for use with at least one computer in a data centre. The power distribution assembly (11) comprises i) at least one controller (14) comprising at least one heat sensitive component (16) and ii) at least one cooling arrangement (17) comprising a casing (18) configured to contain a coolant (19). At least a portion of the coolant (19) is configured to come into contact with at least part of the controller (14) and/or at least one component for transferring heat away from the at least one controller (14)/component (16) towards at least one wall of the casing (18). This arrangement ensures that even in increased temperature data centres, there is provided consistent and reliable operation of heat sensitive components in smart power strips through dedicated cooling of the components (16).