Power-Electronic Module Cooling Unit with Two-Phase Heat Exchanger
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Solution Overview
Problem
Existing power-electronic systems face limitations in cooling performance due to the cost and integration challenges of two-phase cooling systems, which restrict their application in power-electronic systems, especially in systems with semiconductor stacks.
Innovation Solution
A power-electronic module arrangement that integrates a two-phase heat exchanger with flow guides, allowing for efficient cooling of semiconductor modules by blocking airflow between neighboring cooling units, thereby enhancing cooling performance and reducing the need for high airflow rates and fan power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If two-phase cooling systems are used to improve cooling performance, then cooling efficiency increases, but cost and integration complexity increase
Solution Approach 1:
The system is divided into discrete cooling units, each with its own two-phase heat exchanger and flow guides. Each cooling unit can be independently integrated into the power-electronic system, allowing modular assembly and reducing overall integration complexity while maintaining high cooling performance through the two-phase cooling mechanism in each unit.
Solution Approach 2:
Flow guides are introduced as intermediary components that mediate between the external cooling medium and the two-phase heat exchanger. These flow guides direct the external cooling medium through cooling paths that traverse the condenser portion, enabling efficient heat transfer without requiring complex integration of the two-phase system components.
2Productivity
If airflow is blocked between cooling units to improve cooling efficiency, then cooling performance increases, but airflow path complexity increases
Solution Approach 1:
Flow guides are placed at specific locations (alternating sides in depth direction) to block airflow between neighboring cooling units. This localized blocking approach prevents hot air recirculation and improves cooling efficiency without requiring complex system-wide airflow management, as each flow guide operates independently at its specific location.
Solution Approach 2:
The flow guides are arranged asymmetrically, blocking airflow alternately at the first side and second side of cooling units in the depth direction. This asymmetric arrangement creates an optimized airflow pattern that enhances cooling efficiency while avoiding the need for symmetric, complex airflow paths that would require more sophisticated design and control.
3Device complexity
If traditional air cooling is used to reduce cost and complexity, then system cost decreases, but cooling performance is limited
Solution Approach 1:
The system uses a two-phase fluid working medium that undergoes phase change (evaporation and condensation) within the heat exchanger. This pneumatic/hydraulic approach leverages the high heat transfer coefficients of phase change processes to achieve superior cooling performance compared to traditional air cooling, while the modular design keeps overall system complexity manageable.
Solution Approach 2:
The two-phase heat exchanger utilizes phase transitions of the working medium (liquid to vapor in the evaporator portion, vapor to liquid in the condenser portion) to achieve high cooling efficiency. The external cooling medium flows through cooling paths in the condenser portion, facilitating heat transfer during the condensation phase change, which provides superior cooling performance while maintaining reasonable system complexity through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases cooling performance, allows for higher current ratings or lower temperatures, improves reliability, and reduces weight and cost compared to traditional air-cooled systems, while maintaining efficient cooling of semiconductor stacks.
Implementation Method 1
The vaporized two-phase fluid is guided to a condenser, where the fluid returns back to liquid state, transferring the heat to ambient air
Implementation Method 2
The vaporized two-phase fluid is guided to a condenser, where the fluid returns back to liquid state, transferring the heat to ambient air
Implementation Method 3
Each cooling unit includes a two-phase heat exchanger including a plurality of tube elements extending in a width direction of the cooling unit, within and communicating between an evaporator portion and a condenser portion of the cooling unit
Implementation Method 4
the tube elements are arranged in a spaced-apart manner along a depth direction of the cooling unit forming cooling paths for allowing an external cooling medium to flow through the cooling paths for cooling a working medium within the at least one tube element
Data Source
Figure 1
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AI summary
It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.