Power Electronic Device Housing With Connector-Fixed PCB Cooling
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Solution Overview
Problem
The existing assembly process of power electronic devices is cumbersome due to the need to avoid collisions between the second housing and the circuit board assembly during mounting, compromising both heat dissipation and mounting convenience.
Innovation Solution
A power electronic device design where the circuit board assembly is fixed by a connector from the outer side of a housing with a heat dissipation structure, allowing for thermal conduction paths and enabling quick connections between housings without requiring disassembly of the second housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the circuit board assembly is tightly pressed against the first housing by a fastener from the side away from the first housing, then the power device can be made close to the heat dissipation structure for effective heat dissipation, but the second housing must be removed first to avoid collision during mounting, making the mounting process cumbersome and reducing assembling efficiency
Solution Approach 1:
The patent inverts the conventional mounting approach by pressing the circuit board assembly against the first housing from the side closer to the first housing (using a fastener on the first housing side) rather than from the opposite side. This inversion eliminates the need to remove the second housing during mounting, as the fastener and operation device can access the circuit board assembly from the first housing side without colliding with the second housing, thereby improving assembling efficiency while maintaining effective heat dissipation through contact between the power device and heat dissipation structure
2Productivity
If the second housing is kept in place during circuit board assembly mounting, then the mounting process becomes simpler and assembling efficiency improves, but the fastener and operation device collide with the second housing, preventing proper mounting
Solution Approach 1:
The patent changes the mounting direction by pressing the circuit board assembly against the first housing from the first housing side rather than from the opposite side. This allows the fastener and operation device to access the mounting location without colliding with the second housing, enabling the second housing to remain in place during mounting and thereby improving both assembling efficiency and mounting convenience
3Temperature
If the circuit board assembly is mounted with the power device close to the heat dissipation structure, then heat dissipation effectiveness is improved, but the mounting process becomes more complex due to the need to remove and reassemble the second housing
Solution Approach 1:
The patent inverts the mounting approach by pressing the circuit board assembly from the first housing side, which allows the power device to be positioned close to the heat dissipation structure on the first housing without requiring removal of the second housing. This simplifies the mounting process by eliminating complex disassembly and reassembly operations while maintaining effective thermal contact between the power device and heat dissipation structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures effective heat dissipation and facilitates efficient assembly by reducing the need for complex mounting operations, enhancing space utilization and assembly efficiency.
Implementation Method 1
the first housing is in contact with the circuit board assembly in a region corresponding to the power device, and the heat dissipation structure covers at least the region of the first housing corresponding to the power device
Data Source
Figure 1
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AI summary
A power electronic device and a power system are provided. The present application relates to the technical field of electrical technologies. The power electronic device includes a first housing, a second housing, a circuit board assembly and a first connector. The first housing is provided with a heat dissipation structure. The first housing and the second housing enclose to form a mounting cavity, and the circuit board assembly is accommodated inside the mounting cavity. The circuit board assembly includes a circuit board and a power device being mounted to the circuit board. The first connector passes through the first housing from outside to inside and is connected to the circuit board to fix the circuit board at an inner side of the first housing. In a case that the circuit board is fixed at the inner side of the first housing, the first housing contacts the circuit board assembly in a region corresponding to the power device, and the heat dissipation structure at least covers the region of the first housing corresponding to the power device. The present application can satisfy the heat dissipation requirement of the power device of the circuit board assembly and the mounting convenience requirement of the circuit board assembly of the power electronic device at the same time, and is beneficial to compact structural design of the circuit board assembly.